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Bottom-up filling of submicrometer features in catalyst-enhanced chemical vapor deposition of copper
by
SHIM, Kew-Chan
,
LEE, Hyun-Bae
,
KWON, Oh-Kyum
,
PARK, Hyung-Sang
,
KOH, Wonyong
,
KANG, Sang-Won
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Journal of the Electrochemical Society
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Journal Of The Electrochemical Society
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Chemical Vapor Deposition
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Cross-Disciplinary Physics: Materials Science; Rheology
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Electrochemistry
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Exact Sciences And Technology
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Methods Of Deposition Of Films And Coatings; Film Growth And Epitaxy
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