Edgeless silicon sensors for Medipix-based large-area X-ray imaging detectors by Bosma, M J, Visser, J, Evrard, O, Moor, P De, Munck, K De, Tezcan, D Sabuncuoglu, Koffeman, E N

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Wafer Scale Processing of Plasmonic Nanoslit Arrays in 200mm CMOS Fab Environment by Malachowski, Karl, Verbeeck, Rita, Dupont, Tania, Chen, Chang, Li, Yi, Musa, Silke, Stakenborg, Tim, Sabuncuoglu Tezcan, Deniz, Van Dorpe, Pol

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CMOS Compatible Anodization Process for Low Cost High Density Capacitors by Detalle, Mikael, Rakowski, Michal, Potoms, Goedele, Mercha, Abdelkarim, De Potter de ten Broeck, Muriel, Phommahaxay, Alain, Sabuncuoglu Tezcan, Deniz, Soussan, Philippe

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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

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Integrated fluidic system for bio-molecule separation by Hiraoka, M, Fiorini, P, Zhang, L, De Malsche, W, Majeed, B, Tezcan, D Sabuncuoglu, Desmet, G, Yamashita, I, Van Hoof, C, Op de Beeck, M

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Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance by Mercha, A, Van der Plas, G, Moroz, V, De Wolf, I, Asimakopoulos, P, Minas, N, Domae, S, Perry, D, Choi, M, Redolfi, A, Okoro, C, Yang, Y, Van Olmen, J, Thangaraju, S, Tezcan, D S, Soussan, P, Cho, J H, Yakovlev, A, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

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Design and fabrication of a biomedical Lab-on-Chip system for SNP detection in DNA by op de Beeck, M, De Malsche, W, Hiraoka, M, Fiorini, P, Zhang, L, op de Beeck, J, Majeed, B, Tanaka, H, Sabuncuoglu Tezcan, Deniz, Desmet, G, Ueda, D, Van Hoof, C, Yamashita, I

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A low cost uncooled infrared microbolometer focal plane array using the CMOS n-well layer by Sabuncuoglu Tezcan, D., Eminoglu, S., Sevket Akar, O., Akin, T.

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3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias by Swinnen, B., Ruythooren, W., De Moor, P., Bogaerts, L., Carbonell, L., De Munck, K., Eyckens, B., Stoukatch, S., Tezcan, D.S., Tokei, Z., Vaes, J., Van Aelst, J., Beyne, E.

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Electronic-photonic integration in the helios project by Fedeli, J. M., Schrank, F., Bogaerts, W., Masood, A., Zimmermann, L., Augendre, E., Bernabe, S., Kraft, J., Van Olmen, J., Sabuncuoglu Tezcan, D., Grosse, P., Enot, T.

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High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process by De Munck, K., Sabuncuoglu Tezcan, D., Borgers, T., Ruythooren, W., De Moor, P., Sedky, S., Toccafondi, C., Bogaerts, J., Van Hoof, C.

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Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping by Civale, Y., Tezcan, D.S., Philipsen, H.G.G., Jaenen, P., Agarwal, R., Duval, F., Soussan, P., Travaly, Y., Beyne, E.

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A low-cost uncooled infrared microbolometer detector in standard CMOS technology by Tezcan, D.S., Eminoglu, S., Akin, T.

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Low-cost uncooled infrared detectors in CMOS process by Eminoglu, Selim, Tezcan, Deniz Sabuncuoglu, Tanrikulu, M.Yusuf, Akin, Tayfun

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First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency by Minoglou, K., De Munck, K., De Vos, J., Tezcan, D. S., Van Hoof, C., De Moor, P.

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3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias by Civale, Y, Tezcan, D S, Philipsen, H G G, Duval, F F C, Jaenen, P, Travaly, Y, Soussan, P, Swinnen, B, Beyne, E

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On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes by Cavaco, Celso, Peng, Lan, Sebaai, Farid, Verbinnen, Greet, Visker, Jakob, Olmen, Jan, Tezcan, Deniz Sabuncuoglu, Osman, Haris

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Use of Polymer Liners for 3D-WLP TSVs: Process, Reliability and Cost by Sabuncuoglu Tezcan, Deniz, Pham, Nga P., Majeed, Bivragh, Civale, Yann, Beyne, Eric

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Hybrid Backside Illuminated CMOS Imager for High-End Applications by De Vos, Joeri, De Munck, Koen, Erismis, Mehmet Akif, Minoglou, Kiki, Rao, Padmakumar Ramachandra, Zhang, Wenqi, Sabuncuoglu Tezcan, Deniz, De Moor, Piet, Soussan, Philippe

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Improved Liquid Phase Chromatography Separation using Sub-micron Micromachining Technology by Tezcan, D.S., Verbist, A., De Malsche, W., Vangelooven, J., Eghbali, H., Clicq, D., Desmet, G., De Moor, P.

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