Search Results - Sasangka, Wardhana Aji

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  1. 1
    A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers

    A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers by Bao, Shuyu, Wang, Yue, Lina, Khaw, Zhang, Li, Wang, Bing, Sasangka, Wardhana Aji, Lee, Kenneth Eng Kian, Chua, Soo Jin, Michel, Jurgen, Fitzgerald, Eugene, Tan, Chuan Seng, Lee, Kwang Hong

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  2. 2
    Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

    Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process by Lee, Kwang Hong, Tan, Chuan Seng, Wang, Yue, Wang, Bing, Zhang, Li, Sasangka, Wardhana Aji, Goh, Shuh Chin, Bao, Shuyu, Lee, Kenneth E., Fitzgerald, Eugene A.

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  3. 3
    Joining Copper Oxide Nanotube Arrays Driven by the Nanoscale Kirkendall Effect

    Joining Copper Oxide Nanotube Arrays Driven by the Nanoscale Kirkendall Effect by Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip

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  4. 4
    (Invited) Monolithic Integration of Si-CMOS and III-V-on-Si through Direct Wafer Bonding Process

    (Invited) Monolithic Integration of Si-CMOS and III-V-on-Si through Direct Wafer Bonding Process by Lee, Kwang Hong, Zhang, Li, Wang, Bing, Wang, Yue, Sasangka, Wardhana, Lee, Kenneth E., Fitzgerald, Eugene A.

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  5. 5
    Nanotube Arrays: Joining Copper Oxide Nanotube Arrays Driven by the Nanoscale Kirkendall Effect (Small 15/2013)

    Nanotube Arrays: Joining Copper Oxide Nanotube Arrays Driven by the Nanoscale Kirkendall Effect (Small 15/2013) by Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip

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  6. 6
    High temperature performance study of gold wire bonding on a palladium bonding pad

    High temperature performance study of gold wire bonding on a palladium bonding pad by Sasangka, W.A., Tan, A.C.

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