Direct patterning of methylammonium lead bromide perovskites by thermal imprint by Mayer, A., Haeger, T., Runkel, M., Staabs, J., Rond, J., van gen Hassend, F., Görrn, P., Riedl, T., Scheer, H.-C.

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Polymerization related deformations in multilayer soft stamps for nanoimprint by Förthner, M., Papenheim, M., Rumler, M., Stumpf, F., Baier, L., Rommel, M., Scheer, H.-C., Frey, L.

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The underestimated impact of instabilities with nanoimprint by Mayer, A., Dhima, K., Wang, S., Steinberg, C., Papenheim, M., Scheer, H.-C.

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A contribution to the flow behaviour of thin polymer films during hot embossing lithography by Scheer, H.-C, Schulz, H

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Impact of molecular weight of polymers and shear rate effects for nanoimprint lithography by Schulz, H., Wissen, M., Bogdanski, N., Scheer, H.-C., Mattes, K., Friedrich, Ch

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Imprintability of polymers for thermal nanoimprint by Scheer, H.-C., Bogdanski, N., Wissen, M., Möllenbeck, S.

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Fabrication of optimized 3D microstructures with undercuts in fused silica for replication by Zimmer, K., Zajadacz, J., Fechner, R., Dhima, K., Scheer, H.-C.

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Potential and limitations of a T-NIL/UVL hybrid process by Scheer, H.-C., Wissen, M., Bogdanski, N., Möllenbeck, S., Mayer, A.

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Temperature-reduced nanoimprint lithography for thin and uniform residual layers by Bogdanski, N., Wissen, M., Ziegler, A., Scheer, H.-C.

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Measurement and simulation of the pull-off strength at the separation of miniaturized 3D connectors consisting of silicon masters with undercuts and PDMS replicas by Zajadacz, J., Lorenz, P., Ehrhardt, M., Zimmer, K., Möllenbeck, S., Dhima, K., Scheer, H.-C.

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Local mass transport and its effect on global pattern replication during hot embossing by Schulz, H., Wissen, M., Scheer, H.-C.

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Aspects of hybrid pattern definition while combining thermal nanoimprint with optical lithography by Scheer, H.-C., Möllenbeck, S., Mayer, A., Dhima, K.

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Choice of the molecular weight of an imprint polymer for hot embossing lithography by Schulz, H., Wissen, M., Bogdanski, N., Scheer, H.-C., Mattes, K., Friedrich, Ch

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Quality assessment of antisticking layers for thermal nanoimprint by Scheer, H.-C., Häfner, W., Fidler, A., Möllenbeck, S., Bogdanski, N.

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172 nm pre-treatment for PDMS/PDMS replication by Möllenbeck, S., Bogdanski, N., Mayer, A., Scheer, H.-C., Zajadacz, J., Zimmer, K.

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Moulding of arrowhead structures by Möllenbeck, S., Bogdanski, N., Scheer, H.-C., Zajadacz, J., Zimmer, K.

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Profile evolution during thermal nanoimprint by Scheer, H.-C., Bogdanski, N., Wissen, M., Konishi, T., Hirai, Y.

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Viscosity data from thermal imprint experiments by Scheer, H.-C., Bogdanski, N., Shibata, M., Möllenbeck, S.

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Analysis of the filling behaviour of trenches via air bubble tracking by Möllenbeck, S., Bogdanski, N., Wissen, M., Scheer, H.-C., Zajadacz, J., Zimmer, K.

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3D-Hot embossing of undercut structures – an approach to micro-zippers by Bogdanski, N., Schulz, H., Wissen, M., Scheer, H.-C., Zajadacz, J., Zimmer, K.

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