Fine pitch copper wire bonding on copper bond pad process optimization by Kan Wai Lam, Hong Meng Ho, Stoukatch, S., Van De Peer, M., Ratchev, P., Vath, C.J., Schervan, A., Beyne, E.

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AMS-100: The next generation magnetic spectrometer in space – An international science platform for physics and astrophysics at Lagrange point 2 by Schael, S., Atanasyan, A., Berdugo, J., Bretz, T., Czupalla, M., Dachwald, B., von Doetinchem, P., Duranti, M., Gast, H., Karpinski, W., Kirn, T., Lübelsmeyer, K., Maña, C., Marrocchesi, P.S., Mertsch, P., Moskalenko, I.V., Schervan, T., Schluse, M., Schröder, K.-U., Schultz von Dratzig, A., Senatore, C., Spies, L., Wakely, S.P., Wlochal, M., Uglietti, D., Zimmermann, J.

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AMS-100: The Next Generation Magnetic Spectrometer in Space -- An International Science Platform for Physics and Astrophysics at Lagrange Point 2 by Schael, Stefan, Atanasyan, Alexander, Berdugo, Javier, Bretz, Thomas, Czupalla, Markus, Dachwald, Bernd, Philip von Doetinchem, Duranti, Matteo, Gast, Henning, Karpinski, Waclaw, Kirn, Thomas, Lübelsmeyer, Klaus, Maña, Carlos, Marrocchesi, Pier Simone, Mertsch, Philipp, Moskalenko, Igor V, Schervan, Thomas, Schluse, Michael, Schröder, Kai-Uwe, Arndt Schultz von Dratzig, Senatore, Carmine, Spies, L, Wakely, Scott P, Wlochal, Michael, Uglietti, Davide, Zimmermann, Jannik

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