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Search Results - Schuldes, Jesus Gerardo Reyes
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Electrical, Mechanical, Assembly, and Reliability Enabling for 224 Gbps Package Technologies
by
Ye, Duye
,
Geyik, Cemil S.
,
Qian, Zhiguo
,
Walczyk, Joe
,
Kedlaya, Vinayak
,
Schuldes, Jesus Gerardo Reyes
,
Aygun, Kemal
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Ieee Transactions On Components, Packaging, And Manufacturing Technology
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224 Gbps
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Bga
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Conductors
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Dielectric Losses
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High-Speed Signaling
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Impedance
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Insertion Loss
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Package
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Packaging
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Reliability
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Routing
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