Search Results - Senowitz, C.

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  1. 1
    Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding

    Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding by Teh, W H, Deeb, C, Burggraf, J, Arazi, D, Young, R, Senowitz, C, Buxbaum, A

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  2. 2
    Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology

    Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology by Teh, W H, Deeb, C, Burggraf, J, Wimplinger, M, Matthias, T, Young, R, Senowitz, C, Buxbaum, A

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    Integration of copper with low-k dielectrics for 0.13 /spl mu/m technology

    Integration of copper with low-k dielectrics for 0.13 /spl mu/m technology by Gambino, J., Stamper, A., McDevitt, T., McGahay, V., Luce, S., Pricer, T., Porth, B., Senowitz, C., Kontra, R., Gibson, M., Wildman, H., Piper, A., Benson, C., Standaert, T., Biolsi, P., Cooney, E.

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