Search Results - Seogmoon Choi

  • Showing 1 - 10 results of 10
Refine Results
  1. 1
    Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die

    Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die by YOUNG YU, Seon, KWON, Yong-Min, KIM, Jinsu, JEONG, Taesung, CHOI, Seogmoon, PAIK, Kyung-Wook

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Issues in junction-to-case thermal characterization of power packages with large surface area

    Issues in junction-to-case thermal characterization of power packages with large surface area by Vass-Varnai, Andras, Shan Gao, Sarkany, Zoltan, Jongman Kim, Seogmoon Choi, Farkas, Gabor, Poppe, Andras, Rencz, Marta

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package

    Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package by Shan Gao, Jupyo Hong, Sanghyun Shin, Yongki Lee, Seogmoon Choi, Sung Yi

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    Effects of Packaging Materials on the Reliability of System in Package

    Effects of Packaging Materials on the Reliability of System in Package by Shan Gao, Jupyo Hong, Jinsu Kim, Seogmoon Choi, Sung Yi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  5. 5
    Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP)

    Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP) by Shan Gao, Jupyo Hong, Jinsu Kim, Jingu Kim, Seogmoon Choi, Sung Yi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die

    Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die by Seon Young Yu, Yong-Min Kwon, Jinsu Kim, Taesung Jeong, Seogmoon Choi, Kyung-Wook Paik

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    Warpage control of wireless LAN SiP during manufacturing process

    Warpage control of wireless LAN SiP during manufacturing process by Shan Gao, Jupyo Hong, Jungho Hyun, Seogmoon Choi, Sung Yi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

    Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter by Shan Gao, Jupyo Hong, Taehoon Kim, Seogmoon Choi, Sung Yi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  9. 9
    Parametric design study for minimized warpage of WL-CSP

    Parametric design study for minimized warpage of WL-CSP by Jupyo Hong, Shan Gao, Seoungwook Park, SeonHee Moon, Jonghwan Baek, Seogmoon Choi, Sung Yi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    "CCTO thin film growth on a Cu plated Si wafer by pulse laser deposition at low temperatures"

    "CCTO thin film growth on a Cu plated Si wafer by pulse laser deposition at low temperatures" by Lee, Joseph Y, JungWon Lee, Yul-Kyu Chung, SeogMoon Choi, Jongin Ryu, BumSik Jang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: