Search Results - Seol, Youbin

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  1. 1
    On Encapsulated Dielectric Barrier Discharge Plasma Sources for Radar Cross Section Reduction in Mobile Environments

    On Encapsulated Dielectric Barrier Discharge Plasma Sources for Radar Cross Section Reduction in Mobile Environments by Choi, Minsu, You, Shin-Jae, Jung, Jinwoo, Cho, Changseok, Lee, Yongshik, Kim, Cheonyoung, Ha, Jungje, Lee, Hyunsoo, Seol, Youbin

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  2. 2
    Study on characteristics of electron parameters on inert gas addition in a capacitively coupled SF6/O2 plasma

    Study on characteristics of electron parameters on inert gas addition in a capacitively coupled SF6/O2 plasma by Seol, Youbin, Chang, Hong Young, Ahn, Seung Kyu, You, Shin Jae

    Published in AIP advances
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  3. 3
    On radar cross section reduction effect by filamentary discharge in a dielectric barrier discharge

    On radar cross section reduction effect by filamentary discharge in a dielectric barrier discharge by Minsu Choi, Shin-Jae You, Jinwoo Jung, Changseok Cho, Yongshik Lee, Cheonyoung Kim, Jungje Ha, Hyunsoo Lee, Youbin Seol

    Published in AIP advances
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  4. 4
    Study on OH Radical Production Depending on the Pulse Characteristics in an Atmospheric-Pressure Nanosecond-Pulsed Plasma Jet

    Study on OH Radical Production Depending on the Pulse Characteristics in an Atmospheric-Pressure Nanosecond-Pulsed Plasma Jet by Seol, Youbin, Choi, Minsu, Chang, Hongyoung, You, Shinjae

    Published in Materials
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  5. 5
    Effect of mixing CF4 with O2 on electron characteristics of capacitively coupled plasma

    Effect of mixing CF4 with O2 on electron characteristics of capacitively coupled plasma by Seol, Youbin, Chang, Hong Young, Ahn, Seung Kyu, You, Shin Jae

    Published in Physics of plasmas
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  6. 6
    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Controlled

    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Contro... by Jeong, Wonnyoung, Kim, Sijun, Lee, Youngseok, Cho, Chulhee, Seong, Inho, You, Yebin, Choi, Minsu, Lee, Jangjae, Seol, Youbin, You, Shinjae

    Published in Materials
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  7. 7
    Enhancement of Ar Ion Flux on the Substrate by Heterogeneous Charge Transfer Collision of Ar Atom with He Ion in an Inductively Coupled Ar/He Plasma

    Enhancement of Ar Ion Flux on the Substrate by Heterogeneous Charge Transfer Collision of Ar Atom with He Ion in an Inductively Coupled Ar/He Plasma by Seong, Inho, Kim, Sijun, Choi, Minsu, Lee, Woobeen, Jeong, Wonnyoung, Cho, Chulhee, You, Yebin, Lee, Youngseok, Seol, Youbin, You, Shinjae

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  8. 8
    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO 2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C 4 F 8 Plasma: Individual Ion Energy and Flux Controlled

    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO 2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C 4 F 8 Plasma: Individual Ion Energy and Flux Co... by Jeong, Wonnyoung, Kim, Sijun, Lee, Youngseok, Cho, Chulhee, Seong, Inho, You, Yebin, Choi, Minsu, Lee, Jangjae, Seol, Youbin, You, Shinjae

    Published in Materials
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  9. 9
    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO[sub.2] Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C[sub.4]F[sub.8] Plasma: Individual Ion Energy and Flux Controlled

    Contribution of Ion Energy and Flux on High-Aspect Ratio SiO[sub.2] Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C[sub.4]F[sub.8] Plasma: Individual Ion Ener... by Jeong, Wonnyoung, Kim, Sijun, Lee, Youngseok, Cho, Chulhee, Seong, Inho, You, Yebin, Choi, Minsu, Lee, Jangjae, Seol, Youbin, You, Shinjae

    Published in Materials
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  10. 10
    Characterization of SiO2 Plasma Etching with Perfluorocarbon (C4F8 and C6F6) and Hydrofluorocarbon (CHF3 and C4H2F6) Precursors for the Greenhouse Gas Emissions Reduction

    Characterization of SiO2 Plasma Etching with Perfluorocarbon (C4F8 and C6F6) and Hydrofluorocarbon (CHF3 and C4H2F6) Precursors for the Greenhouse Gas Emissions Reduction by Choi, Minsu, Lee, Youngseok, You, Yebin, Cho, Chulhee, Jeong, Wonnyoung, Seong, Inho, Choi, Byeongyeop, Kim, Sijun, Seol, Youbin, You, Shinjae, Yeom, Geun Young

    Published in Materials
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  11. 11
    Characterization of SiO[sub.2] Plasma Etching with Perfluorocarbon Precursors for the Greenhouse Gas Emissions Reduction

    Characterization of SiO[sub.2] Plasma Etching with Perfluorocarbon Precursors for the Greenhouse Gas Emissions Reduction by Choi, Minsu, Lee, Youngseok, You, Yebin, Cho, Chulhee, Jeong, Wonnyoung, Seong, Inho, Choi, Byeongyeop, Kim, Sijun, Seol, Youbin, You, Shinjae, Yeom, Geun Young

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