Tissue Reconstruction: Cellular Hydrogel Biopaper for Patterned 3D Cell Culture and Modular Tissue Reconstruction (Adv. Healthcare Mater. 5/2012) by Lee, Wonhye, Bae, Chae Yun, Kwon, Seyong, Son, Jaejung, Kim, Jinho, Jeong, Yong, Yoo, Seung-Schik, Park, Je-Kyun

Get full text

Evaluation of Joint Resistance Between Bi-2223/Ag Superconducting Tapes by Jung Ho Kim, Jinho Joo, Hyungsup Kim, Seung Boo Jung, Seyong Choi, Nah, W.

Get full text

Microstructural and crystallographic imperfections of MgB{sub 2} superconducting wire and their correlation with the critical current density by Shahabuddin, Mohammed, Alzayed, Nasser S., Oh, Sangjun, Choi, Seyong, Maeda, Minoru, Hata, Satoshi, Shimada, Yusuke, Hossain, Md Shahriar Al, Kim, Jung Ho, Institute for Superconducting and Electronic Materials, University of Wollongong, North Wollongong, New South Wales 2500

Get full text

Magnetization Loss of MgB2 Superconducting Wire at Various Temperatures by Choi, Seyong, Hossain, M. S. A., Kim, Jung Ho, Dou, Shi Xue, Yoon, Jang-Hee, Lee, Byoung-Seob, Won, Mi-Sook, Kiyoshi, Tsukasa, Kang, Joonsun, Kang, Hyoungku, Lee, Se-Hee

Get full text

Design and Implementation of Papyrus: Parallel Aggregate Persistent Storage by Jungwon Kim, Sajjapongse, Kittisak, Seyong Lee, Vetter, Jeffrey S.

Request full text

AC transport current loss of horizontally attached Bi-2223/Ag tapes by CHOI, Seyong, NAH, Wansoo, JUNG HO KIM, JOO, Jinho, JO, Young-Ho, RYU, Kyung-Woo

Get full text

Cohesive techniques for cell layout optimization supporting 2D metal-1 routing completion by Jo, Kyeongrok, Ahn, Seyong, Kim, Taewhan, Choi, Kyumyung

Request full text

Influence of Non-Uniform Current Distribution on AC Transport Current Loss in Bi-2223/Ag Tapes by Seyong Choi, Su-Jeong Suh, Nah, W., Yong Ho Ma, Kyung-Woo Ryu, Jung Ho Kim, Jinho Joo, Myung-Hwan Sohn, Young-Kil Kwon

Get full text

마이크로캡슐이 폴리머 수지의 기계적 특성 및 열안정성에 미치는 영향 by 윤성호, Sungho Yoon, 김민식, Minsik Kim, 장세용, Seyong Jang

Get full text

Superior MgB2 Superconducting Wire Performance through Oxygen-Free Pyrene Additive by Maeda, Minoru, Kim, Jung Ho, Heo, Yoon-Uk, Kwon, Se Kyun, Kumakura, Hiroaki, Choi, Seyong, Nakayama, Yoshitake, Takano, Yoshiki, Dou, Shi Xue

Get full text

Characteristics of critical current and index n of Bi-2223/Ag tape up to 30 T at 4.2 K by Jung Ho Kim, Jinho Joo, Seyong Choi, Nah, W., Dong-Woo Ha, Hong-Soo Ha, Matsumoto, A., Kumakura, H., Koizumi, T., Sugano, M., Kiyoshi, T.

Get full text

Magnetization loss of stacked bi-2223/Ag tapes in external magnetic field by Seyong Choi, Nah, W., Jung Ho Kim, Jinho Joo, Dae-Haing Huh, Kyung-Woo Ryu, Sugano, M., Kiyoshi, T., Myung-Hwan Sohn, Young-Kil Kwon

Get full text

Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) on the Reflow Reliability of Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro Bump Interconnection by Seyong Lee, Jiwon Shin, Woojeong Kim, Taejin Choi, Kyung-Wook Paik

Request full text

The new 2.0 l and 2.2 l four-cylinder diesel engine family of Hyundai-Kia by Lee, Eunhyun, Kwak, Seyong, Kim, Minhee, Joo, Sungbaek, Chun, Jerok, Pae, Sangsoo, Yu, Jun, Grimm, Jürgen

Get full text

A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly by HanMin Lee, SeYong Lee, Park, JongHo, Chang-kyu Chung, Kyung-Woon Jang, Il Kim, SeongWoo Choi, Kyung-Wook Paik

Request full text

Tailored joint fabrication process derived ultra-low resistance MgB2 superconducting joint by Patel, Dipak, Matsumotoa, Akiyoshi, Kumakura, Hiroaki, Nishijima, Gen, Maeda, Minoru, Su-Hun, Kim, Choi, Seyong, Jung Ho Kim

Get full text

Measurement of joint properties of Bi(Pb)-Sr-Ca-Cu-O (2223) tapes by field decay technique by Jung Ho Kim, Kyu Tae Kim, Jang, S.H., Jinho Joo, Seyong Choi, Nah, W., Kang, H., Tae Kuk Ko, Hong-Soo Ha, Sang-Soo Oh, Kang-Sik Ryu, Nash, P.

Get full text

Tailored materials for high-performance MgB(2) wire by Kim, Jung Ho, Oh, Sangjun, Kumakura, Hiroaki, Matsumoto, Akiyoshi, Heo, Yoon-Uk, Song, Kyeong-Se, Kang, Yong-Mook, Maeda, Minoru, Rindfleisch, Matt, Tomsic, Mike, Choi, Seyong, Dou, Shi Xue

Get full text

Synthesis of resonant clock networks supporting dynamic voltage / frequency scaling by Seyong Ahn, Minseok Kang, Papaefthymiou, Marios C., Taewhan Kim

Request full text

The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection by SeYong Lee, HanMin Lee, JongHo Park, SangMyung Shin, WooJeong Kim, TaeJin Choi, Kyung-Wook Paik

Request full text