Case Presentation of Rare Intrathoracic Tumor: Primary Pulmonary Synovial Sarcoma by Shang Chun Hung, Yue-Chiu Su, Yu-Wei Liu, Jui-Sheng Hsu

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A call-to-service design for mobile robots using Zigbee sensor networks by Sin-Yi Jiang, Shang-Chun Hung, Kai-Tai Song

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A bubble bursting-mediated oral drug delivery system that enables concurrent delivery of lipophilic and hydrophilic chemotherapeutics for treating pancreatic tumors in rats by Chen, Kuan-Hung, Miao, Yang-Bao, Shang, Chun-Yu, Huang, Tring-Yo, Yu, Yu-Tzu, Yeh, Chun-Nan, Song, Hsiang-Lin, Chen, Chiung-Tong, Mi, Fwu-Long, Lin, Kun-Ju, Sung, Hsing-Wen

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The Moderating Effect of Self-Efficacy on Fitness Use Innovativeness and Usage Pattern by Satjawathee, Theeralak, Ma, Shang-Chun, Shu, Shih-Tung, Chang, Ching-Hung

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Lemon Peel Water Extract: A Novel Material for Retinal Health, Protecting Retinal Pigment Epithelial Cells against Dynamin-Related Protein 1-Mediated Mitochondrial Fission by Block... by Tsou, Shang-Chun, Chuang, Chen-Ju, Wang, Inga, Chen, Tzu-Chun, Yeh, Jui-Hsuan, Hsu, Chin-Lin, Hung, Yu-Chien, Lee, Ming-Chung, Chang, Yuan-Yen, Lin, Hui-Wen

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Is mobile gaming a new pillar of esports? Exploring players' in-game purchases in PC and mobile platforms by using flow and clutch by Chou, Ssu-Yun, Jang, Wooyoung (William), Ma, Shang Chun, Chang, Ching-Hung, Byon, Kevin K.

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Fitness innovativeness, duration of stay, and revisit behavior: a moderation relationship by Chang, Ching-Hung, Robinson, Leigh, Shu, Shih-Tung, Ma, Shang-Chun

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Effects of pontic span and fiber reinforcement on fracture strength of multi-unit provisional fixed partial dentures by Chang, Min-Chieh, Hung, Chun-Cheng, Chen, Wen-Cheng, Tseng, Shang-Chun, Chen, Yung-Chung, Wang, Jen-Chyan

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3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV) by Shen, Wen-Wei, Kao, Ming-Jer, Chen, Kuan-Neng, Lin, Yu-Min, Chen, Shang-Chun, Chang, Hsiang-Hung, Chang, Tao-Chih, Lo, Wei-Chung, Lin, Chien-Chung, Chou, Yung-Fa, Kwai, Ding-Ming

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Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration by Jui-Chin Chen, Lau, J. H., Pei-Jer Tzeng, Shang-Chun Chen, Chien-Ying Wu, Chien Chou Chen, Yu Chen Hsin, Yi-Feng Hsu, Shang Hung Shen, Sue-Chen Liao, Chi-Hon Ho, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

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Resident reactions to staging Tour de Taiwan 2012 : comparison of pre- and post-event by Ma, Shang-Chun, Chang, Ching-Hung, Hsu, Lung-Chih

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Key enabling technologies of 300mm 3DIC process integration by Pei-Jer Tzeng, Yu-Chen Hsin, Jui-Chin Chen, Shang-Chun Chen, Chien-Ying Wu, Wen-Li Tsai, Chung-Chih Wang, Chi-Hon Ho, Chien-Chou Chen, Yi-Feng Hsu, Shang-Hung Shen, Sue-Chen Liao, Chun-Hsien Chien, Hsiang-Hung Chang, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

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Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers by Yu-Chen Hsin, Chien-Chou Chen, Lau, J. H., Pei-Jer Tzeng, Shang-Hung Shen, Yi-Feng Hsu, Shang-Chun Chen, Chien-Ying Wn, Jui-Chin Chen, Tzu-Kun Ku, Ming-Jer Kao

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Process integration of 3D Si interposer with double-sided active chip attachments by Pei-Jer Tzeng, Lau, John H., Chau-Jie Zhan, Yu-Chen Hsin, Po-chih Chang, Yiu-Hsiang Chang, Jui-Chin Chen, Shang-Chun Chen, Chien-Ying Wu, Ching-Kuan Lee, Hsiang-Hung Chang, Chun-Hsien Chien, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao, Ming Li, Cline, Julia, Saito, Keisuke, Ji, Mandy

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Backside-TSV process development and integration for 2∼3um small size TSV by Tzu-Chien Hsu, Po-Chih Chang, Chung-Chih Wang, Yiu-Hsiang Chang, Tsuen-Sung Chen, Yu-Chen Hsin, Jui-Chin Chen, Yuan-Chang Lee, Shang-Chun Chen, Jen-Chun Wang, Chao-Kai Hsu, Su-Hsin Lin, Chiung-Yu Lo, Hsiang-Hung Chang, Chih-Lin Wang

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Technologies and challenges of fine-pitch backside via-last 3DIC TSV process integration and its electrical characteristics and system applications by Erh-Hao Chen, Tzu-Chien Hsu, Cha-Hsin Lin, Pei-jer Tzeng, Chung-Chih Wang, Shang-Chun Chen, Jui-Chin Chen, Chien-Chou Chen, Yu-Chen Hsin, Po-Chih Chang, Yiu-Hsiang Chang, Shin-Chiang Chen, Yu-Ming Lin, Sue-Chen Liao, Cheng-Ta Ko, Chau-Jie Zhan, Hsiang-Hung Chang, Chun-Hsien Chien, Yung-Fa Chou, Ding-Ming Kwai, Wei-Chung Lo, Tzu-Kun Ku, Ming-Jer Kao

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An extensive study for the impacts of structure-wise TSVs on position-oriented MOSFETs with TSV signal disturbance by Pei-Jer Tzeng, Chung-Chih Wang, Li-Hsin Chang, Shang-Chun Chen, Shang-Hung Shen, Chih-Ta Shen, Shih-Hui Wang, Sue-Chen Liao, Cha-Hsin Lin, Dun-Ying Shu, Chwan-Ying Lee, Ming-Jer Kao

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First-Principles Study of GeO2/Ge Interfacial Traps and Oxide Defects by Shang-Chun Lu, Hung-Chih Chang, Tien-Pei Chou, Cheewee Liu

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