Search Results - Shantaram, Sandeep

  • Showing 1 - 16 results of 16
Refine Results
  1. 1
    Mechanical deformation behavior of SAC305 at high strain rates

    Mechanical deformation behavior of SAC305 at high strain rates by Lall, P., Shantaram, S., Suhling, J., Locker, D.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  2. 2
    Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys

    Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys by Lall, Pradeep, Shantaram, Sandeep, Suhling, Jeff, Locker, Dave

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions

    Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions by Fahim, Abdullah, Zhang, Ryan, Mavinkurve, Amar, Shantaram, Sandeep, Adli, Ali Rezaie, Tanwongwan, Wiwat, Hauck, Torsten

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

    High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics by Lall, P., Panchagade, D.R., Iyengar, D., Shantaram, S., Schrier, H.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics

    Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics by Lall, Pradeep, Shantaram, Sandeep, Panchagade, Dhananjay

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Resolution of extreme warpage in ultra-thin molded array packages under High Temperature Storage Life

    Resolution of extreme warpage in ultra-thin molded array packages under High Temperature Storage Life by Lakhera, Nishant, Shantaram, Sandeep, Singh, Akhilesh K.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

    Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration by Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D.

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:
  8. 8
    Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact

    Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact by Lall, P., Shantaram, S., Angral, A., Kulkarni, M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  9. 9
    Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys

    Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys by Lall, P., Shantaram, S., Suhling, J., Locker, D.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration

    Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration by Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D., Suhling, J.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  11. 11
    Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

    Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration by Lall, P., Iyengar, D., Shantaram, S., Gupta, P., Panchagade, D., Suhling, J.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  12. 12
    High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

    High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics by Lall, P., Panchagade, D., Iyengar, D., Shantaram, S., Suhling, J., Schrier, H.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  13. 13
    Reliability modeling of electronic systems subjected to high strain rates

    Reliability modeling of electronic systems subjected to high strain rates by Lall, P., Shantaram, S., Locker, D.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  14. 14
    High strain-rate mechanical properties of SnAgCu leadfree alloys

    High strain-rate mechanical properties of SnAgCu leadfree alloys by Lall, P., Shantaram, S., Kulkarni, M., Limaye, G., Suhling, J.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  15. 15
    Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

    Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration by Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  16. 16
    Development and Validation of UV-Visible Spectrophotometric Method for Simultaneous Determination of Eperisone and Paracetamol in Solid Dosage Form

    Development and Validation of UV-Visible Spectrophotometric Method for Simultaneous Determination of Eperisone and Paracetamol in Solid Dosage Form by Khanage, Shantaram Gajanan, Mohite, Popat Baban, Jadhav, Sandeep

    Get full text
    Article
    Save to List
    Saved in:

Search Tools: