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Structure and electric resistance of Sn–Cu(Ag) solders in the precrystallization temperature range
by
Mudryi, S. I.
,
Shtablavyi, I. I.
,
Sklyarchuk, V. M.
,
Plevachuk, Yu. O.
,
Korolyshyn, A. V.
,
Yakymovych, A. S.
,
Shevernoha, I. M.
,
Sidorov, B. E.
Published in
Materials science (New York, N.Y.)
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