Off-grid sparse based two-dimensional direction of arrival estimation of acoustic vector sensor array in impulse noise by Liang, Longkai, Shi, Yiran, Shi, Yaowu, Bai, Zhejia, He, Wenchao, Lv, Xuhao

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FEM simulation on microstructure of DC flash butt welding for an ultra-fine grain steel by Wang, Weibin, Shi, Yaowu, Lei, Yongping, Tian, Zhiling

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Wind speed and direction measurement based on arc ultrasonic sensor array signal processing algorithm by Li, Xinbo, Sun, Haixin, Gao, Wei, Shi, Yaowu, Liu, Guojun, Wu, Yue

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Development of an Er-doped Mg–Zn–Al solder by ultrasonic treatment and its joint property by Li, Guodong, Li, Zhuoxin, Li, Hui, Shi, Yaowu

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Joint DOA and D oppler frequency estimation of coherent and/or same‐direction signals by Shan, Zebiao, Liu, Xiaosong, Wang, Chunyang, Shi, Hongwei, Shi, Yaowu

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A novel ultrasonic array signal processing scheme for wind measurement by Li, Xinbo, Zhu, GeYan, Gao, Wei, Sun, Haixin, Liu, Guojun, Wu, Yue, Shi, Yaowu

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Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles by Tai, Feng, Guo, Fu, Liu, Jianping, Xia, Zhidong, Shi, Yaowu, Lei, Yongping, Li, Xiaoyan

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Parameter estimation of wideband cyclostationary sources based on uni-vector-sensor by Zhou Xin, Shi Yaowu, Guo Hongzhi, Li Jun

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Effects of electromigration on resistance changes in eutectic SnBi solder joints by Sun, Jia, Xu, Guangchen, Guo, Fu, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan, Wang, Xitao

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Effect of weld thermal cycle on microstructure and fracture toughness of simulated heat-affected zone for a 800MPa grade high strength low alloy steel by Shi, Yaowu, Han, Zhunxiang

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Joint DOA and Doppler frequency estimation of coherent and/or same‐direction signals by Shan, Zebiao, Liu, Xiaosong, Wang, Chunyang, Shi, Hongwei, Shi, Yaowu

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On the cross-terms in LPPs by Xinbo Li, Youyi Wang, Guoan Bi, Yaowu Shi, Xiumei Li

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Effect of assist gas flow on the gas shielding during laser deep penetration welding by Wang, Hong, Shi, Yaowu, Gong, Shuili, Duan, Aiqin

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Study on Cu particles-enhanced SnPb composite solder by Yan, Yanfu, Liu, Jianping, Shi, Yaowu, Xia, Zhidong

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Modified Volterra model-based non-linear model predictive control of IC engines with real-time simulations by Shi, Yiran, Yu, Ding-Li, Tian, Yantao, Shi, Yaowu

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Compression creep of 63Sn37Pb solder balls by Zhang, Ning, Yang, Fuqian, Shi, Yaowu, Guo, Fu

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Effect of pressure gradient driven convection in the molten pool during the deep penetration laser welding by Wang, Hong, Shi, Yaowu, Gong, Shuili

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Interior crack and its formation mechanism in overlaying weld of back-up rolls by Wang, Qingbao, Li, Zhuoxin, Shi, Yaowu, Wang, Lizhi, Liu, Fei

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Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy by Dong, Wenxing, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, Guo, Fu

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A Model for Rapid Tin Whisker Growth on the Surface of ErSn^sub 3^ Phase by Hao, Hu, Xu, Guangchen, Song, Yonglun, Shi, Yaowu, Guo, Fu

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