Search Results - Shiohara, Morio

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  1. 1
    Effect of Pattern Layout and Dissolved Oxygen in CO2 Rinse Water on Cu Corrosion during Post-Etch Cleaning

    Effect of Pattern Layout and Dissolved Oxygen in CO2 Rinse Water on Cu Corrosion during Post-Etch Cleaning by Tokuri, Kentaro, Yamashita, Yukinari, Shiohara, Morio, Oda, Noriaki, Kondo, Seiichi, Saito, Shuichi

    Published in Jpn J Appl Phys
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  2. 2
    Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance

    Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance by Takigawa, Yukio, Tarumi, Nobuaki, Shiohara, Morio, Soda, Eiichi, Oda, Noriaki, Ogawa, Shinichi

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  3. 3
    Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process

    Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process by Imai, Masayoshi, Yamashita, Yukinari, Futatsuki, Takashi, Shiohara, Morio, Kondo, Seiichi, Saito, Shuichi

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  4. 4
    Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography

    Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography by Nakamura, Naofumi, Oda, Noriaki, Soda, Eiichi, Aoyama, Hajime, Tanaka, Yuusuke, Kawamura, Daisuke, Hosoi, Nobuki, Takigawa, Yukio, Shiohara, Morio, Kondo, Seiichi, Mori, Ichiro, Saito, Shuichi

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  5. 5
    Galvanic Corrosion Control in Chemical Mechanical Polishing of Cu Interconnects with Ruthenium Barrier Metal Film

    Galvanic Corrosion Control in Chemical Mechanical Polishing of Cu Interconnects with Ruthenium Barrier Metal Film by Maruyama, Koji, Shiohara, Morio, Yamada, Kouji, Kondo, Seiichi, Saito, Shuichi

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  6. 6
    Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance

    Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance by Takigawa, Yukio, Tarumi, Nobuaki, Shiohara, Morio, Soda, Eiichi, Oda, Noriaki, Ogawa, Shinichi

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  7. 7
    Amorphous Ru / Polycrystalline Ru Highly Reliable Stacked Layer Barrier Technology

    Amorphous Ru / Polycrystalline Ru Highly Reliable Stacked Layer Barrier Technology by Ogawa, Shinichi, Tarumi, Nobuaki, Abe, Mitsuhide, Shiohara, Morio, Imamura, Hiroki, Kondo, Seiichi

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  8. 8
    Effect of Pattern Layout and Dissolved Oxygen in CO 2 Rinse Water on Cu Corrosion during Post-Etch Cleaning

    Effect of Pattern Layout and Dissolved Oxygen in CO 2 Rinse Water on Cu Corrosion during Post-Etch Cleaning by Tokuri, Kentaro, Yamashita, Yukinari, Shiohara, Morio, Oda, Noriaki, Kondo, Seiichi, Saito, Shuichi

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  9. 9
    Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography

    Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography by Nakamura, Naofumi, Oda, Noriaki, Soda, Eiichi, Aoyama, Hajime, Tanaka, Yuusuke, Kawamura, Daisuke, Hosoi, Nobuki, Takigawa, Yukio, Shiohara, Morio, Kondo, Seiichi, Mori, Ichiro, Saito, Shuichi

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