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High Density Automotive Module with Fan-Out Package
by
Shiroi, Wataru
,
Kariyazaki, Shuuichi
,
Kayashima, Yuji
,
Betsui, Takafumi
,
Machida, Shiro
,
Nakagawa, Kazyuyuki
,
Akiba, Toshihiko
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Format
Conference Proceedings
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Subjects
Automotive Reliability
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Connected Vehicles
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Degradation
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Driving Ability
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Fan-Out Package
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Fanout
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High Density
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High Performance Computing
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Layout
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Manufacturability
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Multi-Chip Module
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Multichip Modules
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Packaging
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Packaging Technology
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Reliability Engineering
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Substrates
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System On Chip
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System-On-Chip
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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