Design and fabrication of a MEMS scanning mirror with and without comb offset by Yick Chuen Chan, Chun Cheong Wong, Congshun Wang, Wei Ma, Ho-Yin Chan, Shoulung Chen, Hon Lung Cheung, Lee, F C S, Chen-Jung Tsai

Request full text

Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP by Cheng-Ta Ko, Shoulung Chen, Chia-Wen Chiang, Tzu-Ying Kuo, Ying-Ching Shih, Yu-Hua Chen

Request full text

Study on the effects of wafer thinning and dicing on chip strength by Chen, S., Tsai, C.Z., Wu, E., Shih, I.G., Chen, Y.N.

Get full text

The evaluation of wafer thinning and singulating processes to enhance chip strength by Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu, Jyh-Rong Lin, Shan-Pu Yu

Request full text

Mechanical behavior of flip chip packages under thermal loading by Shoulung Chen, Tsai, C.Z., Kao, N., Enboa Wu

Request full text

Chip-in-substrate package, CiSP, technology by Yu-Hua Chen, Jyh-Rong Lin, Shoulung Chen, Cheng-Ta Ko, Tzu-Ying Kuo, Chien-wei Chien, Shan-Pu Yu, Ostmann, A., Neumann, A.

Request full text

Study of chip strength due to backside grinding on wafer by Chen, Shoulung, Tsai, Cheng-Zorn, Hung, Kou-Chan, Wu, Enboa

Get full text

How to improve chip strength to avoid die cracking in a package by Shoulung Chen, Shih, I.G., Chen, Y.N., Tsai, C.Z., Lin, J.W., Enboa Wu

Request full text