An RCP Packaged Transceiver Chipset for Automotive LRR and SRR Systems in SiGe BiCMOS Technology by Trotta, S., Wintermantel, M., Dixon, J., Moeller, U., Jammers, R., Hauck, T., Samulak, A., Dehlink, B., Shun-Meen, K., Hao Li, Ghazinour, A., Yi Yin, Pacheco, S., Reuter, R., Majied, S., Moline, D., Aaron, T., Trivedi, V. P., Morgan, D. J., John, J.

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A testing method and device for intrinsic stress measurement in wafer bumping process by Yifan Guo, Mitchell, D., Sarihan, V., Shun-Meen Kuo, Jung-Kai Lin, Yeung, B., Lee, T., Dawei Zheng

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A low cost, high performance optical interconnect by Schwartz, D.B., Chun, C.K.Y., Foley, B.M., Hartman, D.H., Lebby, M., Lee, H.C., Chan Long Shieh, Shun Meen Kuo, Shook, S.G., Webb, B.

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A low-cost high-performance optical interconnect by Schwartz, D.B., Chun, C.K.Y., Foley, B.M., Hartman, D.H., Lebby, M., Lee, H.C., Chan Long Shieh, Kuo, S.M., Shook, S.G., Webb, B.

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Analysis of flip-chip packaging challenges on copper/low-k interconnects by Mercado, L.L., Goldberg, C., Kuo, S.-M., Tien-Yu, Tom Lee, Pozder, S.K.

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Stress/strength and reliability evaluations on UBM in different solder systems by Guo, Y., Shun-Meen Kuo, Mercado, L.

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Analysis of flip-chip packaging challenges on copper/low-k interconnects: Interface reliability by MERCADO, Lei L, GOLDBERG, Cindy, KUO, Shun-Meen, LEE, Tien-Yu, POZDER, Scott K

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