Search Results - Siek, K.H.

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  1. 1
    A scanning conduction microscopic method for probing abrasion of insulating thin films

    A scanning conduction microscopic method for probing abrasion of insulating thin films by Dickinson, J.T., Siek, K.H., Hipps, K.W.

    Published in Tribology letters
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  2. 2
    Novel backside sample preparation processes for advanced CMOS integrated circuits failure analysis

    Novel backside sample preparation processes for advanced CMOS integrated circuits failure analysis by Chew, Y.Y., Siek, K.H., Yee, W.M.

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  3. 3
    Electrical analysis to fault isolate defects in 6T memory cells

    Electrical analysis to fault isolate defects in 6T memory cells by Wong, V.K., Lock, C.H., Siek, K.H., Tan, P.J.

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  4. 4
    Application of focused ion beam system as a defect localization and root cause analysis tool

    Application of focused ion beam system as a defect localization and root cause analysis tool by Ooi, C.C., Siek, K.H., Sim, K.S.

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  5. 5
    Multiple techniques approach failure analysis for a blocked p+ implant induced leakage in an ESD protection diode

    Multiple techniques approach failure analysis for a blocked p+ implant induced leakage in an ESD protection diode by Wong, V.K., Low, P.F., Lock, C.H., Siek, K.H.

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    When Do We Eat? An Evaluation of Food Items Input into an Electronic Food Monitoring Application

    When Do We Eat? An Evaluation of Food Items Input into an Electronic Food Monitoring Application by Siek, K.A., Connelly, K.H., Rogers, Y., Rohwer, P., Lambert, D., Welch, J.L.

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  7. 7
    Overloading in multistage sigma-delta modulators

    Overloading in multistage sigma-delta modulators by Chow, M.K.H., Chan, P.K., Siek, L.

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