Progressive Dystonia in Mohr-Tranebjaerg Syndrome With Cochlear Implant and Deep Brain Stimulation by Cif, Laura, Gonzalez, Victoria, Garcia-Ptacek, Sara, James, Syril, Boetto, Julien, Seychelles, Anne, Roujeau, Thomas, Moura De Ribeiro, Ana Maria, Sillon, Martine, Mondain, Michel, Coubes, Philippe

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Le Sillon à Pau : journée du 6 août 1905, rapport (de M. Boutilhe) et discussions by Boutilhe. Auteur du texte

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Influence of communication mode on speech intelligibility and syntactic structure of sentences in profoundly hearing impaired French children implanted between 5 and 9 years of age by Vieu, A, Mondain a, M, Blanchard, K, Sillon, M, Reuillard-Artieres, F, Tobey, E, Uziel a, A, Piron, J.P

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Cochlear implantation in prelingually deafened children with residual hearing by Mondain, Michel, Sillon, Martine, Vieu, Adrienne, Levi, Ann, Reuillard-Artieres, Françoise, Deguine, Olivier, Fraysse, Bernard, Cochard, Nadine, Truy, Eric, Uziel, Alain

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J01A European collection of veterinary pathogens isolated from sick food producing animals prior to antimicrobial treatment by THOMAS, V., BYWATER, R., CHATON-SCHAFFNER, M., DEROOVER, E., DE JONG, A., KLEIN, U., MARION, H., SILLON, M., STEGEMANN, M., VALL, M., WALTERS, J.

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J01
A European collection of veterinary pathogens isolated from sick food producing animals prior to antimicrobial treatment by THOMAS, V., BYWATER, R., CHATON‐SCHAFFNER, M., DEROOVER, E., DE JONG, A., KLEIN, U., MARION, H., SILLON, M., STEGEMANN, M., VALL, M., WALTERS, J.

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Calpain 3 Is Activated through Autolysis within the Active Site and Lyses Sarcomeric and Sarcolemmal Components by Taveau, Mathieu, Bourg, Nathalie, Sillon, Guillaume, Roudaut, Carinne, Bartoli, Marc, Richard, Isabelle

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Imaging Calpain Protease Activity by Multiphoton FRET in Living Mice by Stockholm, Daniel, Bartoli, Marc, Sillon, Guillaume, Bourg, Nathalie, Davoust, Jean, Richard, Isabelle

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RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits by Bermond, C., Brocard, M., Lacrevaz, T., Farcy, A., Le Maître, P., Leduc, P., Ben Jamaa, H., Chéramy, S., Sillon, N., Fléchet, B.

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System on Wafer: A New Silicon Concept in SiP by Poupon, Gilles, Batude, Perrine, Sillon, Nicolas, Henry, David, Gillot, Charlotte, Mathewson, Alan, Di Cioccio, Lea, Charlet, Barbara, Leduc, Patrick, Vinet, Maud

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RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking by Cadix, L., Bermond, C., Fuchs, C., Farcy, A., Leduc, P., DiCioccio, L., Assous, M., Rousseau, M., Lorut, F., Chapelon, L.L., Flechet, B., Sillon, N., Ancey, P.

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Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking by Cadix, Lionel, Fuchs, Christine, Rousseau, Maxime, Leduc, Patrick, Chaabouni, Hamed, Thuaire, Aurelie, Brocard, Melanie, Valentian, Alexandre, Farcy, Alexis, Bermond, Cedric, Sillon, Nicolas, Ancey, Pascal, Fléchet, Bernard

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"RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking" by Cadix, L., Farcy, A., Bermond, C., Fuchs, C., Lorut, F., Leduc, P., Assous, M., Rousseau, M., Chapelon, L.L., Bicais, N., Flechet, B., Sillon, N., Ancey, P.

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(Invited) Future Challenges and Diversifications for Nanoelectronics by the End of the Roadmap and Beyond by Deleonibus, S., Aid, M., De Salvo, B., Ernst, T., Faynot, O., Fedeli, J.-M., Giffard, B., Le Royer, C., Poiroux, T., Robert, P., Sillon, N., Vinet, M.

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Process solutions and polymer materials for 3D-WLP through silicon via filling by Bouchoucha, M, Chausse, P, Henry, D, Sillon, N

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Through silicon vias technology for CMOS image sensors packaging by Henry, D., Jacquet, F., Neyret, M., Baillin, X., Enot, T., Lapras, V., Brunet-Manquat, C., Charbonnier, J., Aventurier, B., Sillon, N.

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Investigation on TSV impact on 65nm CMOS devices and circuits by Chaabouni, H, Rousseau, M, Leduc, P, Farcy, A, El Farhane, R, Thuaire, A, Haury, G, Valentian, A, Billiot, G, Assous, M, De Crecy, F, Cluzel, J, Toffoli, A, Bouchu, D, Cadix, L, Lacrevaz, T, Ancey, P, Sillon, N, Flechet, B

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Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits by Cadix, L., Farcy, A., Bermond, C., Fuchs, C., Leduc, P., Rousseau, M., Assous, M., Valentian, A., Roullard, J., Eid, E., Sillon, N., Flechet, B., Ancey, P.

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Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications by Charbonnier, J, Hida, R, Henry, D, Cheramy, S, Chausse, P, Neyret, M, Hajji, O, Garnier, G, Brunet-Manquat, C, Haumesser, P H, Vandroux, L, Anciant, R, Sillon, N, Farcy, A, Rousseau, M, Cuzzocrea, J, Druais, G, Saugier, E

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Integration of a temporary carrier in a TSV process flow by Charbonnier, J., Cheramy, S., Henry, D., Astier, A., Brun, J., Sillon, N., Jouve, A., Fowler, S., Privett, M., Puligadda, R., Burggraf, J., Pargfrieder, S.

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