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450mm Cu single damascene BEOL process with 20nm half-pitched features
by
Sunoo Kim
,
Dunn, Shannon
,
Smith, Steven
,
Collision, WenLi
,
Prudhomme, Jamie
,
Huey-Ming Wang
,
Maniscalco, Joe
,
Yathapu, Nithin
,
Chulgi Song
,
Wang, Barry
,
Carr, Christopher
,
Hsi-Wen Liu
,
Gall, Bruce
,
Alaestante, Angelo
,
Min-Hui Chen
,
Conti, Richard
,
ChungJu Yang
,
Sullivan, Denis
,
Culafi, Kosta
,
Moon, BumKi
,
Yii-Cheng Lin
,
Yu-Lieh Fu
,
Sieg, Katherine
,
Larrea, Anne-Sophie
,
Fish, Norman
,
Swaine, Regina
,
Bialy, Alexander
,
Tallon, Milo
,
Stapf, Gerard
,
Hagwood, John
,
Bryant, Michael
,
Cottle, Rand
,
Chang, Stock
,
Kelling, Mark
,
Schaefer, Karsten
,
Franca, Dan
,
Pinyen Lin
,
Borst, Christopher
,
Kwangwook Lee
,
JongHeun Lim
,
Skilbred, David
,
Chien, Cc
,
Robertson, Frank
,
Fria, Erin
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Opportunities and challenges of the 450mm transition
by
Lin, John
,
Pinyen Lin
,
Wen-Yu Ku
,
Kelling, Mark C.
,
Akiki, Greg
,
Sangdong Kwon
,
Kwangwook Lee
,
Collison, Wenli
,
Chang, Stock
,
Cottle, Rand
,
Yu-Chih Wang
,
Borst, Christopher
,
Skilbred, David
,
Robertson, Frank
,
Farrar, Paul
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Effect of metal contaminants in pre-gate oxide cleans for sub-100-nm devices
by
Pathangey, B.
,
McCarthy, L.D.
,
Skilbred, D.C.
Published in
IEEE transactions on device and materials reliability
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Ieee Transactions On Device And Materials Reliability
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Copper
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Engineering, Electrical & Electronic
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450Mm
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Cu Beol
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