77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing by Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang

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Heterogeneous 2.5D integration on through silicon interposer by Zhang, Xiaowu, Lin, Jong Kai, Wickramanayaka, Sunil, Zhang, Songbai, Weerasekera, Roshan, Dutta, Rahul, Chang, Ka Fai, Chui, King-Jien, Li, Hong Yu, Wee Ho, David Soon, Ding, Liang, Katti, Guruprasad, Bhattacharya, Suryanarayana, Kwong, Dim-Lee

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A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers by Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Sandra, San, Jong, Ming Chinq, Lai Yee, Chia, Long, Lau Boon, Soon Wee Ho, David, Choong, Chong Ser, Liang, Ding, Tu, Xiaoguang, Wang, Wanjun, Tan, Chee-Keong, See, Alison, Wang, Hsiu-Che, Coccioli, Roberto, Tan, Ronson, Nagarajan, Radhakrishnan, Bhattacharya, Surya

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Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application by Chen Zihao, Lim Teck Guan, Ho, David Soon Wee, Bhattacharya, Surya

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3D FOWLP Integration by Guan, Lim Teck, Soon Wee Ho, David, Chong, Chai Tai, Bhattacharya, Surya

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Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package by Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong

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A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres by Nair Gourikutty, Sajay Bhuvanendran, Long, Lau Boon, Wei, Seit Wen, Jong, Ming Chinq, Wee Ho, David Soon, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Choong, Chong Ser, Yee, Chia Lai, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

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Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning by Pahwa, Ramanpreet Singh, Lay Nwe, Ma Tin, Chang, Richard, Min, Oo Zaw, Jie, Wang, Gopalakrishnan, Saisubramaniam, Soon Wee, David Ho, Qin, Ren, Rao, Vempati Srinivasa, Dai, Haiwen, Neumann, Jens Timo, Pichumani, Ramani, Gregorich, Tom

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NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging by Chou, Teyuh, Tang, Wei, Rotaru, Mihai D., Liu, Chester, Dutta, Rahul, Pei Siang, Sharon Lim, Wee, David Ho Soon, Bhattacharya, Surya, Zhang, Zhengya

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FOWLP and Si-Interposer for High-Speed Photonic Packaging by Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya

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Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging by Lianto, Prayudi, Tan, Chin Wei, Jie Peng, Qi, Jumat, Abdul Hakim, Dai, Xundong, Peter Fung, Khai Mum, Huei See, Guan, Chong, Ser Choong, Wee David Ho, Soon, Serine Soh, Siew Boon, Huang Sharon Lim, Seow, Calvin Chua, Hung Ming, Abdillah Haron, Ahmad, Kenneth Lee, Huan Ching, Zhang, Mingsheng, Ko, Zhi Hao, Ko San, Ye, Leong, Henry

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Development of Package-on-Package Using Embedded Wafer-Level Package Approach by Ser Choongv Chong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar

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Electrical Design for the Development of FOWLP for HBM Integration by Lim, Teck Guan, Wee, David Ho Soon

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Assembly challenges and demonstrations of ultra-large Antenna in Package for Automotive Radar applications by Lim, Sharon Pei Siang, Chong, Ser Choong, Wee, David Ho Soon, Chai, Tai Chong

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A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications by Gourikutty, Sajay Bhuvanendran Nair, Jong, Ming Chinq, Kanna, Chockanathan Vinoth, Ho, David Soon Wee, Wei, Seit Wen, Siang, Sharon Lim Pei, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

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Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples by Giusti, Dominico, Gritti, Alex, Quaglia, Fabio, Savoia, Alessandro Stuart, Sandoh, Hideyuki, Klug, Gerald, Hoshino, Hitoshi, Rahul, Dutta, Rao, Vempati Srinivasa, Wee, David Ho Soon, Wakahara, Masatoshi, Shaw, Mark

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Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans by Pahwa, Ramanpreet Singh, Gopalakrishnan, Saisubramaniam, Su, Huang, Ping, Ong Ee, Dai, Haiwen, Wee, David Ho Soon, Qin, Ren, Rao, Vempati Srinivasa

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FOWLP Design for Digital and RF Circuits by Lim, Teck Guan, Ho, David Soon Wee, Ching, Eva Wai Leong, Chen, Zihao, Bhattacharya, Surya

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3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer by Chong, Chai Tai, Long, Lau Boon, Siang, Sharon Lim Pei, Wee, David Ho Soon, van Kampen, Rob, Castillou, Paul, Gaddi, Roberto, Barron, Lance, Renault, Mickael, Ko, Jay, Hammond, Jonathan

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Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package by Zhaohui Chen, Faxing Che, Mian Zhi Ding, Ho, David Soon Wee, Chai, Tai Chong, Srinivasa, Vempati

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