Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection by Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.

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Three-dimensional silicon integration by Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L

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Thermomechanical modeling of 3D electronic packages by Sri-Jayantha, S M, McVicker, G, Bernstein, K, Knickerbocker, J U

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TrueTrack servo technology for high TPI disk drives by SRI-JAYANTHA, Sri M, HIEN DANG, SHARMA, Arun, YONEDA, Isao, KITAZAKI, Nabuyuki, YAMAMOTO, Satoshi

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Thermomechanical modeling of 3D electronic packages: 3D chip technology by SRI-JAYANTHA, S. M, MCVICKER, G, BERNSTEIN, K, KNICKERBOCKER, J. U

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Characterization of micro-bump C4 interconnects for Si-carrier SOP applications by Wright, S.L., Polastre, R., Gan, H., Buchwalter, L.P., Horton, R., Andry, P.S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J.R., Sharma, A., Sri-Jayantha, M.S.

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Three-dimensional silicon integration: 3D chip technology by KNICKERBOCKER, J. U, ANDRY, P. S, SRI-JAYANTHA, S. M, STEPHENS, A. M, TOPOL, A. W, TSANG, C. K, WEBB, B. C, WRIGHT, S. L, DANG, B, HORTON, R. R, INTERRANTE, M. J, PATEL, C. S, POLASTRE, R. J, SAKUMA, K, SIRDESHMUKH, R, SPROGIS, E. J

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Adaptive servo control of vibration induced error by Sri-Jayantha, S.M., Hien Dang, Sharma, A.

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TrueTrack super(TM) servo technology for high TPI disk drives by Sri-Jayantha, S M, Dang, Hien, Sharma, A, Yoneda, I, Kitazaki, N, Yamamoto, S

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System-on-package (SOP) technology, characterization and applications by Knickerbocker, J.U., Andry, P.S., Buchwalter, L.P., Colgan, E.G., Cotte, J., Gan, H., Horton, R.R., Sri-Jayantha, S.M., Magerlein, J.H., Manzer, D., McVicker, G., Patel, C.S., Polastre, R.J., Sprogis, E.S., Tsang, C.K., Webb, B.C., Wright, S.L.

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The Role of Static Charge in Ultra-Low Alpha Particle Emissivity Measurements by Gordon, Michael S., Rodbell, Kenneth P., Murray, Conal E., Sri-Jayantha, Sri M., McNally, Brendan D.

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Impact of Organic Substrate Warp on C4 Non-Wets by Khanna, V. D., Sri-Jayantha, Sri M.

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Impact of Organic Substrate Warp on C4 Non-Wets : Best-of-Session Papers from the 60th Electronic Components and Technology Conference by KHANNA, Vijay D, SRI-JAYANTHA, Sri M

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Adaptive mounting system for data storage devices by Smith, Gordon James, Sri-Jayantha, Sri M.

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Novel mass reflow method for organic substrates by Khanna, Vijay D., Sri-Jayantha, Sri M.

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Methodology for predicting C4 non-wets during the chip attach process by Khanna, Vijay D, Sri-Jayantha, Sri M

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Effect of Joule heating on electromigration reliability of Pb-free interconnect by Minhua Lu, Wright, S. L., McVicker, G., Sri-Jayantha, Sri M.

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A study of the head disk interface shock failure mechanism by Kumar, S., Khanna, V.D., Sri-Jayantha, M.

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Feedback control of impact dynamics of a moving-coil actuator by MUTHUTHAMBY SRI-JAYANTHA

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Digital servo control of a novel disk actuator by Sri-Jayantha, M., Chainer, T.J., Brown, D.H.

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