A Method For In-Situ Measurement Of The Film Thickness And Composition Of Films Deposited by Gas Injection In The FIB-SEM by Lang, C., Burgess, S., Kerr, G., Statham, P., Hartfield, C., Stierman, R.

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Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability by Zeng, Kejun, Stierman, Roger, Chiu, Tz-Cheng, Edwards, Darvin, Ano, Kazuaki, Tu, K. N.

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Effect of thermal aging on board level drop reliability for Pb-free BGA packages by CHIU, Tz-Cheng, KEJUN ZENG, STIERMAN, Roger, EDWARDS, Darvin, ANO, Kazuaki

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Thickness dependence of the anisotropy in thermal expansion of PMDA-ODA and BPDA-PDA thin films by LIOU, H.-C, HO, P. S, STIERMAN, R

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Influence of composition on some physical properties of the narrow band material CeSn3 by GSCHNEIDNER, K. A. JR, DHAR, S. K, STIERMAN, R. J, TSANG, T.-W. E, MCMASTERS, O. D

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The magnetic susceptibility of lutetium-hydrogen solid solution alloys from 2 to 300 K and a re-evaluation of the low temperature heat capacity results by Stierman, R.J., Gschneidner, K.A.

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Wafer level packaging of a tape flip-chip chip scale packages by Hotchkiss, Greg, Amador, Gonzalo, Edwards, Darvin, Hundt, Paul, Stark, Les, Stierman, Roger, Heinen, Gail

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Magnetic susceptibility and electrical resistivity of electrotransport purified scandium single crystals from ≈ 1 to 300 k by Stierman, R.J., Gschneidner, K.A., Tsang, T.-W.E., Schmidt, F.A., Klavins, P., Shelton, R.N., Queen, J., Legvold, S.

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Influence of high magnetic fields (10 T) on paramagnons in rare-earth intermetallic compounds by Gschneidner, K.A., Ikeda, K., Tsang, T.-W.E., McMasters, O.D., Stierman, R.J., Eucker, S.S., Lambert, S.E., Maple, M.B., Buchal, C.

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Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating by Kejun Zeng, Stierman, R., Abbott, D., Murtuza, M.

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Quenching of spin fluctuations in the highly enhanced paramagnets RCo2(R=Sc, Y, or Lu) by IKEDA, K, GSCHNEIDNER, K. A. JR, STIERMAN, R. J, TSANG, T.-W. E, MCMASTERS, O. D

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Anisotropic spin fluctuations in cubic CeSn3 by TSANG, T.-W. A, GSCHNEIDER, K. A. JR, MCMASTERS, O. D, STIERMAN, R. J, DHAR, S. K

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Multichip assembly with flipped integrated circuits by Heinen, K.G., Schroen, W.H., Edwards, D.R., Wilson, A.M., Stierman, R.J., Lamson, M.A.

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The Magnetic Susceptibility of Lutetium--Hydrogen Solid-Solution Alloys from 2 to 300K and a Re-Evaluation of the Low-Temperature Heat Capacity Results by Stierman, R J, Gschneidner, K A

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Influence of Composition on Some Physical Properties of the Narrow Band Material CeSn sub 3 by Gschneidner, K A, Dhar, S K, Stierman, R J, Tsang, T-W E, McMasters, O D

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Low cost etchant for Ta-based copper barrier by Gabunas, C.B., Abitan, F.F., Stierman, R.J.

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Drinking Water From Private Wells and Risks to Children by Woolf, Alan D, Stierman, Bryan D, Barnett, Elizabeth D, Byron, Lori G

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Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications by Hotchkiss, G., Amador, G., Jacobs, L., Stierman, R., Dunford, S., Hundt, P., Beikmohamadi, A., Cairncross, A., Gantzhorn, O., Quinn, B., Saltzberg, M.

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Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping by Beikmohamadi, A., Cairncross, A., Gantzhorn, J.E., Quinn, B.R., Saltzberg, M.A., Hotchkiss, G., Amador, G., Jacobs, L., Stierman, R., Dunford, S., Hundt, P.

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Quenching of Spin Fluctuations in the Highly Enhanced Paramagnets RCo sub 2 (R = Scandium, Yttrium or Lutetium) by Ikeda, K, Gschneidner, K A, Stierman, R J, Tsang, T-W E, McMasters, O D

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