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Search Results - Stralka, Tillmann
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(111)‐Oriented Growth and Acceptor Doping of Transparent Conductive CuI:S Thin Films by Spin Coating and Radio Frequency‐Sputtering
by
Geng, Fangjuan
,
Wang, Liangjun
,
Stralka, Tillmann
,
Splith, Daniel
,
Ruan, Siyuan
,
Yang, Jialin
,
Yang, Lei
,
Gao, Gang
,
Xu, Liangge
,
Lorenz, Michael
,
Grundmann, Marius
,
Zhu, Jiaqi
,
Yang, Chang
Published in
Advanced engineering materials
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Grain and Grain Boundary Conduction Channels in Copper Iodide Thin Films
by
Stralka, Tillmann
,
Bar, Michael
,
Schöppach, Fabian
,
Selle, Susanne
,
Yang, Chang
,
von Wenckstern, Holger
,
Grundmann, Marius
Published in
Physica status solidi. A, Applications and materials science
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Controllable Growth of Copper Iodide for High-Mobility Thin Films and Self-Assembled Microcrystals
by
Yang, Chang
,
Rose, Eduard
,
Yu, Wenlei
,
Stralka, Tillmann
,
Geng, Fangjuan
,
Lorenz, Michael
,
Grundmann, Marius
Published in
ACS applied electronic materials
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Acs Applied Electronic Materials
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Advanced Engineering Materials
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Physica Status Solidi. A, Applications And Materials Science
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Materials Science
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Materials Science, Multidisciplinary
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Science & Technology
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Technology
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Sputtering
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Atomic Force Microscopy
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Carrier Transport
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Copper Iodide
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Copper Iodide Thin Film
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Current Carriers
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Current Probe Atomic Force Microscopy
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Electric Potential
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Electrical Resistivity
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Engineering
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Engineering, Electrical & Electronic
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Grain Boundaries
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Growth Mechanism
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High Mobility
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Oriented Growth
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Oxygen Plasma
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Wiley Journals
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Wiley:jisc Collections:wiley Read And Publish Open Access 2024-2025 (Reading List)
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Wiley Online Library (Open Access Collection)
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Access Via American Chemical Society
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