Ultra low stress and low temperature patternable silicone materials for applications within microelectronics by Meynen, H., Vanden Bulcke, M., Gonzalez, M., Harkness, B., Gardner, G., Sudbury-Holtschlag, J., Vandevelde, B., Winters, C., Beyne, E.

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Introducing a silicone under the bump configuration for stress relief in a wafer level package by Vanden Bulcke, M., Gonzalez, M., Vandevelde, B., Winters, C., Beyne, E., Larson, L., Harkness, B.R., Gardner, G., Mohamed, M., Sudbury-Holtschlag, J., Meynen, H.

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