Novel Bumping Material for Solder‐on‐Pad Technology by Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung

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Novel Bumping and Underfill Technologies for 3D IC Integration by Sung, Ki‐Jun, Choi, Kwang‐Seong, Bae, Hyun‐Cheol, Kwon, Yong‐Hwan, Eom, Yong‐Sung

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Novel Maskless Bumping for 3D Integration by Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung

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Novel Bumping and Underfill Technologies for 3D IC Integration by Sung, Ki-Jun

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Fan-out Wafer Level Package for Memory Applications by Son, Ho-Young, Sung, Ki-Jun, Choi, Bok-Kyu, Kim, Jong-Hoon, Lee, Kangwook

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Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications by Sung, Ki-Jun, Eun, Kyoungtae, Kim, Jae-Min, Jang, Se-Hyun, Lee, Seowon, Yoon, Sungwon, Kim, Jongkwan, Kim, Minsuk, Yun, Jiyeong, Ju, Jeongho, Son, Ho-Young, Lee, Kang-Wook

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Novel Bumping Material for Solder-on-Pad Technology by Choi, Kwang-Seong, Chu, Sun-Woo, Lee, Jong-Jin, Sung, Ki-Jun, Bae, Hyun-Cheol, Lim, Byeong-Ok, Moon, Jong-Tae, Eom, Yong-Sung

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Novel Maskless Bumping for 3D Integration by Choi, Kwang-Seong, Sung, Ki-Jun, Lim, Byeong-Ok, Bae, Hyun-Cheol, Jung, Sung-Hae, Moon, Jong-Tae, Eom, Yong-Sung

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Analysis of electromigration for Cu pillar bump in flip chip package by Jae-Hyouk Yoo, In-Soo Kang, Gi-Jo Jung, Sungdong Kim, Hyo-Sok Ahn, Won-Ho Choi, Ki-Sung Jun, Doo-Wool Jang, In-Hong Baek, Joo-Nam Yu

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Bumping and stacking processes for 3D IC using fluxfree polymer by Kwang-Seong Choi, Ki-Jun Sung, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom

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Optimized TSV process using bottom-up electroplating without wafer cracks by Byeong-Ok Lim, Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, Sunghae Jung, Ki-Jun Sung, Jong-Tae Moon

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3D SiP module using TSV and novel solder bump maker by Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Byeong-Ok Lim, Ki-Jun Sung, Sunghae Jung, Byeung-Gee Kim, In-Soo Kang, Jong-Tae Moon

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Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding by Kwang-Seong Choi, Sun-Woo Choo, Jong-Jin Lee, Ki-Jun Sung, Hyun-Chel Bae, Byeong-Ok Lim, Jong-Tae Moon, Yong-Sung Eom

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Solder Bump Maker with coining process on TSV chips for 3D packages by Ki-Jun Sung, Kwang-Seong Choi, Byeong-Ok Lim, Hyun-Cheol Bae, Sun-Woo Choo, Jong-Tae Moon, Yong Hwan Kwon, Eun Soo Nam, Yong-Sung Eom

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Novel bumping material for stacking silicon chips by Kwang-Seong Choi, Ki-Jun Sung, Byeong-Ok Lim, Hyun-Cheol Bae, Sunghae Jung, Jong Tae Moon, Yong Sung Eom

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Novel Bumping and Underfill Technologies for 3D IC Integration by Sung, Ki-Jun, Choi, Kwang-Seong, Bae, Hyun-Cheol, Kwon, Yong-Hwan, Eom, Yong-Sung

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Novel Bumping and Underfill Technologies for 3D IC Integration by Ki-Jun Sung, Kwang-Seong Choi, Hyun-Cheol Bae Bae, Yong-Hwan Kwon, and Yong-Sung Eom

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Soft Materials in Neuroengineering for Hard Problems in Neuroscience by Jeong, Jae-Woong, Shin, Gunchul, Park, Sung Il, Yu, Ki Jun, Xu, Lizhi, Rogers, John A.

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Isolation of fully synthetic promoters for high-level gene expression in Corynebacterium glutamicum by Yim, Sung Sun, An, Seul Ji, Kang, Misuk, Lee, Jinho, Jeong, Ki Jun

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Metformin Augments Anti-Inflammatory and Chondroprotective Properties of Mesenchymal Stem Cells in Experimental Osteoarthritis by Park, Min-Jung, Moon, Su-Jin, Baek, Jin-Ah, Lee, Eun-Jung, Jung, Kyung-Ah, Kim, Eun-Kyung, Kim, Da-Som, Lee, Jung-Ho, Kwok, Seung-Ki, Min, Jun-Ki, Kim, Seok Jung, Park, Sung-Hwan, Cho, Mi-La

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