Phenomenological classification of stress-induced leakage current and time-dependent dielectric breakdown mechanism by Miyazaki, Hiroshi, Kodama, Daisuke, Suzumura, Naohito

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Suppression of Stress-Induced Voiding by Controlling Microstructure of Cu Electroplated Films by Muranaka, Seiji, Omori, Kazuyuki, Mori, Kenichi, Maekawa, Kazuyoshi, Shibata, Ryuji, Suzumura, Naohito, Kudo, Shuichi, Fujisawa, Masahiko

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Phenomenological classification of stress-induced leakage currentand time-dependent dielectric breakdown mechanism by Miyazaki, Hiroshi, Kodama, Daisuke, Suzumura, Naohito

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Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression by Tsuchiya, Hideaki, Suzumura, Naohito, Shibata, Ryuji, Aono, Hideki, Ogasawara, Makoto, Akiba, Toshihiko, Sakata, Kenji, Nakagawa, Kazuyuki, Funaya, Takuo

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Impact of Al in Cu alloy interconnects on electro and stress migration reliabilities by Maekawa, Kazuyoshi, Mori, Kenichi, Suzumura, Naohito, Honda, Kazuhito, Hirose, Yukinori, Asai, Koyu, Uedono, Akira, Kojima, Masayuki

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Cu Dual-Damascene Interconnects with Direct Chemical Mechanical Polishing Process on Porous Low-$k$ Film by Izumitani, Junko, Kodama, Daisuke, Kido, Shigenori, Chibahara, Hiroyuki, Oka, Yoshihiro, Goto, Kinya, Suzumura, Naohito, Fujisawa, Masahiko, Miyatake, Hiroshi

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Highly reliable 45-nm-half-pitch Cu interconnects incorporating a Ti/TaN multilayer barrier by Hamada, Masakazu, Ohmori, Kazuyuki, Mori, Kenichi, Kobori, Etsuyoshi, Suzumura, Naohito, Etou, Ryuji, Maekawa, Kazuyoshi, Fujisawa, Masahiko, Miyatake, Hiroshi, Ikeda, Atsushi

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The simplest modification of Cu diffusion barrier dielectrics to improve Cu/Low-k interconnects reliability by Goto, K., Oka, Y., Suzumura, N., Shibata, R., Furuhashi, T., Matsumoto, M., Kawamura, T., Matsuura, M., Fujisawa, M., Asai, K.

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Effects of N doping in Ru-Ta alloy barrier on film property and reliability for Cu interconnects by Torazawa, N., Hinomura, T., Mori, K., Koyama, Y., Hirao, S., Kobori, E., Korogi, H., Maekawa, K., Tomita, K., Chibahara, H., Suzumura, N., Asai, K., Miyatake, H., Matsumoto, S.

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Effects of Ru-Ta Alloy Barrier on Cu Filling and Reliability for Cu Interconnects by Mori, Kenichi, Ohmori, Kazuyuki, Torazawa, Naoki, Hirao, Shuji, Kaneyama, Syutetsu, Korogi, Hayato, Maekawa, Kazuyoshi, Fukui, Shoichi, Tomita, Kazuo, Inoue, Makoto, Chibahara, Hiroyuki, Imai, Yukari, Suzumura, Naohito, Asai, Koyu, Kojima, Masayuki

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Comprehensive analysis of syndromic hearing loss patients in Japan by Ideura, Michie, Nishio, Shin-ya, Moteki, Hideaki, Takumi, Yutaka, Miyagawa, Maiko, Sato, Teruyuki, Kobayashi, Yumiko, Ohyama, Kenji, Oda, Kiyoshi, Matsui, Takamichi, Ito, Tsukasa, Suzumura, Hiroshi, Nagai, Kyoko, Izumi, Shuji, Nishiyama, Nobuhiro, Komori, Manabu, Kumakawa, Kozo, Takeda, Hidehiko, Kishimoto, Yoko, Iwasaki, Satoshi, Furutate, Sakiko, Ishikawa, Kotaro, Fujioka, Masato, Nakanishi, Hiroshi, Nakayama, Jun, Horie, Rie, Ohta, Yumi, Naito, Yasushi, Kakudo, Mariko, Sakaguchi, Hirofumi, Kataoka, Yuko, Sugahara, Kazuma, Hato, Naohito, Nakagawa, Takashi, Tsuchihashi, Nana, Kanda, Yukihiko, Kihara, Chiharu, Tono, Tetsuya, Miyanohara, Ikuyo, Ganaha, Akira, Usami, Shin-ichi

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Two patients with all-trans retinoic acid-resistant acute promyelocytic leukemia treated successfully with gemtuzumab ozogamicin as a single agent by TAKESHITA, Akihiro, SHINJO, Kaori, YADA, Yoshihiro, TESHIMA, Hirofumi, TAKEUCHI, Jin, OHNISHI, Kazunori, OHNO, Ryuzo, NAITO, Kensuke, MATSUI, Hirotaka, SAHARA, Naohi, SHIGENO, Kazuyuki, SUZUMURA, Taeko, HORII, Toshinobu, SHIRAI, Naohito, MAEKAWA, Masato

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