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Effect of mechanical treatment type on the strength of undoped single crystal indium antimonide wafers
by
Kormilitsina, Svetlana S.
,
Molodtsova, Elena V.
,
Knyzev, Stanislav N.
,
Kozlov, Roman Yu
,
Zavrazhin, Dmitry A.
,
Zharikova, Elena V.
,
Syrov, Yuri V.
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Peer Reviewed
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Articles
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Modern Electronic Materials
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Subjects
Bend Strength
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1
Chemical Polishing
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Crys-Tallographic Orientation
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Czochralsky Method
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Damage
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Electronic Components Industry
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Indium
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Indium Antimonide
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Intermetallic Compounds
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Mechanical Treatment
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Roughness
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Semiconductor Industry
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Semiconductors
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Single Crystals
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Thin Wafers
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Wafer Roughness
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Wafers
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Yield Strength
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