Search Results - Syu, Ji-Yuan

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  1. 1
    Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module

    Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module by Lee, Chang-Chun, Wang, Chi-Wei, Syu, Ji-Yuan, Tsai, Wei-Cheng

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  2. 2
    Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test

    Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test by Lee, Chang-Chun, Lin, Yu-Min, Liu, Hou-Chun, Syu, Ji-Yuan, Huang, Yuan-Cheng, Chang, Tao-Chih

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  3. 3
    The Development of 1.7kV 100A SiC MOSFET Power Module for Automotive Application

    The Development of 1.7kV 100A SiC MOSFET Power Module for Automotive Application by Chiu, Po-Kai, Lin, Hsin-Han, Huan, Yuan-Cheng, Syu, Ji-Yuan, Liu, Yan-Cheng, Fan, Yan-Bo, Cheng, Yu-Hua, Chang, Chien-Wei, Hsieh, Yung-Min, Kao, Kuo-Shu, Tsai, Chu-Han

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  4. 4
    Thermal Design of SiC Power Module for EV/HEV Applications

    Thermal Design of SiC Power Module for EV/HEV Applications by Liu, Chun-Kai, Po-Kai, Chiu, Huang, Yuan-Cheng, Syu, Ji-Yuan, Chen, Yao-Shun, Chou, Yu-An, Wu, Kuang-Hung, Pan, Wen-Yang

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  5. 5
    Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model

    Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model by Cheng, Hsien-Chie, Syu, Ji-Yuan, Wang, He-Hong, Liu, Yan-Cheng, Kao, Kuo-Shu, Chang, Tao-Chih

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