Search Results - TOUGUI, Abdellah

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  1. 1
    Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications

    Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications by El Fatmi, Imad, Belhenini, Soufyane, Tougui, Abdellah

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  2. 2
    Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact

    Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact by Belhenini, Soufyane, El Fatmi, Imad, Richard, Caroline, Tougui, Abdellah

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  3. 3
    Implementation of the Homogenization Method in the Numerical Estimation of Wafer Warpage

    Implementation of the Homogenization Method in the Numerical Estimation of Wafer Warpage by Belhenini, Soufyane, El Fatmi, Imad, Richard, Caroline, Tougui, Abdellah, Roqueta, Fabrice

    Published in Coatings (Basel)
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  4. 4
    Elastic modulus measurements of vertically aligned multi walled carbon nanotubes carpets by using the nanoindentation technique

    Elastic modulus measurements of vertically aligned multi walled carbon nanotubes carpets by using the nanoindentation technique by Belhenini, Soufyane, Labbaye, Thibault, Boulmer-Leborgne, Chantal, Kovacevic, Eva, Tougui, Abdellah, Dosseul, Franck

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  5. 5
    3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

    3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters by Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Mohan, Ranganathan, Dosseul, Franck

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  6. 6
    3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials

    3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials by Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Dosseul, Franck

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  7. 7
    Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si

    Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si by Yao, W Z, Roqueta, F, Craveur, J C, Belhenini, S, Gardes, P, Tougui, A

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  8. 8
    3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS

    3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS by BELHENINI, Soufyane, TOUGUI, Abdellah, BOUCHOU, Abdelhake, MOHAN, Ranganathan, DOSSEUL, Franck

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  9. 9
    Fatigue crack initiation at a notch

    Fatigue crack initiation at a notch by Ranganathan, N., Aldroe, H., Lacroix, F., Chalon, F., Leroy, R., Tougui, A.

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  10. 10
    A Comparison of Conventional Local Approach and the Short Crack Approach to Fatigue Crack Initiation at a Notch

    A Comparison of Conventional Local Approach and the Short Crack Approach to Fatigue Crack Initiation at a Notch by Ranganathan, Narayanaswami, Leroy, Rene, Tougui, Abdellah

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  11. 11
    Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM

    Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM by Belhenini, Soufyane, Tougui, Abdellah, Dosseul, Franck

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  12. 12
    3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials

    3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials by Belhenini, S., Bouchou, A., Dosseul, F., Tougui, A.

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