Search Results - Taluy, A.

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  1. 1
    Wafer level underfill entrapment in solder joint during thermocompression: Simulation and experimental validation

    Wafer level underfill entrapment in solder joint during thermocompression: Simulation and experimental validation by Taluy, A., Jouve, A., Joblot, S., Franiatte, R., Bertheau, J., Farcy, A., Cheramy, S., Sillon, N., Ancey, P., Sylvestre, A.

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  2. 2
    Performances of Wafer-Level UnderFill with 50µm pitch interconnections: Comparison with conventional underfill

    Performances of Wafer-Level UnderFill with 50µm pitch interconnections: Comparison with conventional underfill by Taluy, A., Lhostis, Sandrine, Jouve, A., Garnier, G., Dezandre, E., Farcy, A., Cheramy, S., Sillon, N., Sylvestre, A.

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  3. 3
    USA’s Crusade on the Haitian Black Pig Population & its Toll on Haitian Peasantry and Agriculture

    USA’s Crusade on the Haitian Black Pig Population & its Toll on Haitian Peasantry and Agriculture by Taluy, Sarah

    Published in Caribbean quilt
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  4. 4
    The genome sequence of the silver-studded blue, Plebejus argus (Linnaeus, 1758)

    The genome sequence of the silver-studded blue, Plebejus argus (Linnaeus, 1758) by Hayward, Alex, Lohse, Konrad, Laetsch, Dominik R, Vila, Roger, Taluy, Emma

    Published in Wellcome open research
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