Search Results - Tamahashi, Kunihiro

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  1. 1
    Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects

    Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects by Miyamoto, Ryo, Tamahashi, Kunihiro, Inami, Takashi, Sasajima, Yasushi, Onuki, Jin

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  2. 2
    Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects

    Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects by Inami, Takashi, Miyamoto, Ryo, Tamahashi, Kunihiro, Namekawa, Takashi, Ishikawa, Nobuhiro, Ito, Masahiko, Onuki, Jin

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  3. 3
    Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects

    Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects by INAMI, Takashi, TAMAHASHI, Kunihiro, NAMEKAWA, Takashi, CHIBA, Akio, ONUKI, Jin

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  4. 4
    Nano-Structure-Controlled Very Low Resistivity Cu Wires Formed by High Purity and Optimized Additives

    Nano-Structure-Controlled Very Low Resistivity Cu Wires Formed by High Purity and Optimized Additives by Onuki, Jin, Tamahashi, Kunihiro, Inami, Takashi, Nagano, Takatoshi, Sasajima, Yasushi, Ikeda, Shuji

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  5. 5
    Resistivity Reduction in Very Narrow Cu Wiring

    Resistivity Reduction in Very Narrow Cu Wiring by Onuki, Jin, Sasajima, Yasushi, Tamahashi, Kunihiro, Ke, YiQing, Terada, Shohei, Hidaka, Kishio, Itoh, Shinji

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  6. 6
    The Protrusion Behaviors in Cu-TSV during Heating and Cooling Process

    The Protrusion Behaviors in Cu-TSV during Heating and Cooling Process by Liu, Bin, Satoh, Akira, Tamahashi, Kunihiro, Sasajima, Yasushi, Onuki, Jin

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  7. 7
    EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires

    EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires by KE, Yiqing, NAMEKAWA, Takashi, TAMAHASHI, Kunihiro, INAMI, Takashi, ONUKI, Jin

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  8. 8
    Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging

    Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging by Satoh, Akira, Kadota, Hiroyuki, Inami, Takashi, Tamahashi, Kunihiro, Ito, Masahiko, Onuki, Jin

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  9. 9
    Screening of Undesirable Elements Raising the Electrical Resistivity in Very Narrow Cu Wires by Ab Initio Calculation

    Screening of Undesirable Elements Raising the Electrical Resistivity in Very Narrow Cu Wires by Ab Initio Calculation by Nagano, Takatoshi, Tamahashi, Kunihiro, Inami, Takashi, Sasajima, Yasushi, Onuki, Jin

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  10. 10
    High-Temperature Cycle Durability of Superplastic Al-Zn Eutectoid Solder Joints With Stress Relaxation Characteristics for SiC Power Semiconductor Devices

    High-Temperature Cycle Durability of Superplastic Al-Zn Eutectoid Solder Joints With Stress Relaxation Characteristics for SiC Power Semiconductor Devices by Saito, Katsuaki, Tamahashi, Kunihiro, Inami, Takashi, Kobiyama, Mamoru, Sasajima, Yasushi, Onuki, Jin, Kawamata, Yuji

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  11. 11
    Substrate temperature dependence of electrical and structural properties of Ru films

    Substrate temperature dependence of electrical and structural properties of Ru films by Nagano, Takatoshi, Inokuchi, Kazuya, Tamahashi, Kunihiro, Ishikawa, Nobuhiro, Sasajima, Yasushi, Onuki, Jin

    Published in Thin solid films
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  12. 12
    Highly reliable high-temperature superplastic Al-Zn eutectoid solder joining with stress relaxation characteristics for next generation SiC power semiconductor devices

    Highly reliable high-temperature superplastic Al-Zn eutectoid solder joining with stress relaxation characteristics for next generation SiC power semiconductor devices by Onuki, Jin, Chiba, Akio, Kawakami, Mitsuo, Tamahashi, Kunihiro, Sugawara, Yoshitaka, Inami, Takashi, Kobiyama, Mamoru, Motohashi, Yoshinobu, Kawamata, Yuji

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  13. 13
    Cs-Corrected STEM Observation and Atomic Modeling of Grain Boundary Impurities of Very Narrow Cu Interconnect

    Cs-Corrected STEM Observation and Atomic Modeling of Grain Boundary Impurities of Very Narrow Cu Interconnect by Nagano, Takatoshi, Tamahashi, Kunihiro, Sasajima, Yasushi, Onuki, Jin

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  14. 14
    (Invited) Resistivity Reduction in Very Narrow Cu Wiring

    (Invited) Resistivity Reduction in Very Narrow Cu Wiring by Onuki, Jin, Sasajima, Yasushi, Tamahashi, Kunihiro, YiQing, Ke, Terada, Shouhei, Hidaka, Kishio

    Published in ECS transactions
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  15. 15
    Fabrication of a-Si:H electrophotographic photoreceptors by magnetron plasma CVD method

    Fabrication of a-Si:H electrophotographic photoreceptors by magnetron plasma CVD method by Wakagi, Masatoshi, Tamahashi, Kunihiro, Hanazono, Masanobu

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