Search Results - Tan, B.T.C.

  • Showing 1 - 2 results of 2
Refine Results
  1. 1
    Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages

    Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages by Ming Li, Lee, K.Y., Olsen, D.R., Chen, W.T., Tan, B.T.C., Mhaisalkar, S.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages

    Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages by Ka Yau Lee, Ming Li, Olsen, D.R., Chen, W.T., Tan, B.T.C., Mhaisalkar, S.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: