Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging by Lau, John H., Ming Li, Dewen Tian, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Yiu Ming Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Taylor, Thomas, Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Jiang Ran, Cao Xi, Koh Sau Wee, Qingxiang Yong

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Fan-Out Wafer-Level Packaging for Heterogeneous Integration by Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

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Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging by Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, Eric, Kai, Wu, Cheung, Yiu-Ming, Ng, Eric, Xi, Cao, Ran, Jiang, Yang, Henry, Chen, Y. H., Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky

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Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers by Lau, John H., Li, Ming, Yang, Lei, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Madhukumar, Janardhanan Pillai, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, Cheng-Ta, Xi, Cao

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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration by Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

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(Invited) Copper Pillar Bumping Technology-the Promising Ecosystem Changer by Guo, Hong-Yan, Zhang, Li, Tan, Kim-Hwee, Lai, Chi-Ming

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Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging by Lau, John, Ming Li, Tian, Dewen, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Ken Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Cheng-Ta Ko, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Koh Sau Wee, Ran, Jiang, Xi, Cao

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Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations by Lau, John, Li, Ming, Xu, Iris, Chen, Tony, Tan, Kim Hwee, Li, Zhang, Fan, Nelson, Kuah, Eric, So, Raymond, Lo, Penny, Cheung, Y. M., Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky

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Pillar Bump Technology and Integrated Embedded Passive Devices by Asen Long Xin Jiang, Lai Chih Ming, Jeff Chen Yi Gao, Tan Kim Hwee

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Silicon Wafer Backside Thinning with Mechanical and Chemical Method for Better Mechanical Property by Asen Long Xin Jiang, Lai Chih Ming, Jeff Chen Yi Gao, Tan Kim Hwee

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Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers by Lau, John, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Beica, Rozalia, Wee, Koh Sau, Li, Ming, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Yang, Lei, Li, Margie, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson

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Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations by Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Lin, Curry, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Lo, Penny, So, R., Chen, Y. H., Fan, Nelson, Kuah, Eric, Lin, Marc, Cheung, Y. M., Ng, Eric, Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky

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Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers by Lau, John, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, C.T., Xi, Cao, Li, Ming, Lei, Yang, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Janardhanan, Kumar

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Fan-Out Wafer-Level Packaging for Heterogeneous Integration by Lau, John, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Wee, Koh Sau, Ran, Jiang, Xi, Cao, Li, Ming, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Li, Margie, Chen, Tony, Xu, Iris, Yong, Qing Xiang, Cheng, Zhong, Fan, Nelson, Kuah, Eric

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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration by Ko, Cheng-Ta, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y. M., Ng, Eric, Yang, Henry, Kai, Wu, Hao, Ji, Beica, Rozalia, Lin, Marc, Chen, Y.H., Cheng, Zhong, Wee, Koh Sau, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lau, John, Lee, N.C., Tao, Mian, Lo, Jeffery, Lee, Ricky, Li, Ming, Li, Margie, Lin, Curry, Lin, J.W., Chen, Tony, Xu, Iris

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Lymphatic Vessels Are Essential for the Removal of Cholesterol from Peripheral Tissues by SR-BI-Mediated Transport of HDL by Lim, Hwee Ying, Thiam, Chung Hwee, Yeo, Kim Pin, Bisoendial, Radjesh, Hii, Chung Shii, McGrath, Kristine C.Y., Tan, Kar Wai, Heather, Alison, Alexander, J. Steven Jonathan, Angeli, Veronique

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Hyaluronan Receptor LYVE-1-Expressing Macrophages Maintain Arterial Tone through Hyaluronan-Mediated Regulation of Smooth Muscle Cell Collagen by Lim, Hwee Ying, Lim, Sheau Yng, Tan, Chek Kun, Thiam, Chung Hwee, Goh, Chi Ching, Carbajo, Daniel, Chew, Samantha Hui Shang, See, Peter, Chakarov, Svetoslav, Wang, Xiao Nong, Lim, Li Hui, Johnson, Louise A., Lum, Josephine, Fong, Chui Yee, Bongso, Ariff, Biswas, Arijit, Goh, Chern, Evrard, Maximilien, Yeo, Kim Pin, Basu, Ranu, Wang, Jun Kit, Tan, Yingrou, Jain, Rohit, Tikoo, Shweta, Choong, Cleo, Weninger, Wolfgang, Poidinger, Michael, Stanley, Richard E., Collin, Matthew, Tan, Nguan Soon, Ng, Lai Guan, Jackson, David G., Ginhoux, Florent, Angeli, Véronique

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Unobtrusive Monitoring to Detect Depression for Elderly With Chronic Illnesses by Kim, Jung-Yoon, Liu, Na, Tan, Hwee-Xian, Chu, Chao-Hsien

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Hyaluronan Receptor LYVE-1-Expressing Macrophages Maintain Arterial Tone through Hyaluronan-Mediated Regulation of Smooth Muscle Cell Collagen by Lim, Hwee Ying, Lim, Sheau Yng, Tan, Chek Kun, Thiam, Chung Hwee, Goh, Chi Ching, Carbajo, Daniel, Chew, Samantha Hui Shang, See, Peter, Chakarov, Svetoslav, Wang, Xiao Nong, Lim, Li Hui, Johnson, Louise A., Lum, Josephine, Fong, Chui Yee, Bongso, Ariff, Biswas, Arijit, Goh, Chern, Evrard, Maximilien, Yeo, Kim Pin, Basu, Ranu, Wang, Jun Kit, Tan, Yingrou, Jain, Rohit, Tikoo, Shweta, Choong, Cleo, Weninger, Wolfgang, Poidinger, Michael, Stanley, E. Richard, Collin, Matthew, Tan, Nguan Soon, Ng, Lai Guan, Jackson, David G., Ginhoux, Florent, Angeli, Véronique

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Short-term outcomes of laparoscopic and robotic limited resections of pancreatic neuroendocrine tumours of the uncinate process: Report of six cases and review of the literature by Lim, Teik-Wen, Tan, Hwee-Leong, Tan, Ek-Khoon, Cheow, Peng-Chung, Goh, Brian Kim Poh

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