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    Stacked BGA design, development, and materials selection considerations for improved testing and stacking, reduced warpage and environmental stress, and enhanced thermal qualities

    Stacked BGA design, development, and materials selection considerations for improved testing and stacking, reduced warpage and environmental stress, and enhanced thermal qualities by Tan Yong Kian, Tay Wuu Yean, Lee Kian Chai, Ng Hong Wan

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