Search Results - Tegehall, P.E.

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  1. 1
    Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

    Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages by Andersson, C, Vandevelde, B, Noritake, C, Sun, P, Tegehall, P.E, Andersson, D.R, Wetter, G, Liu, J

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  2. 2
    Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints

    Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints by Andersson, C., Andersson, D.R., Tegehall, P.E., Liu, J.

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  3. 3
    Thermal cycling of leadfree Sn3.8Ag0.7Cu 388PBGA packages

    Thermal cycling of leadfree Sn3.8Ag0.7Cu 388PBGA packages by Andersson, C., Vandevelde, B., Noritake, C., Sun, P., Tegehall, P.E., Andersson, D.R., Wetter, G., Liu, J.

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  4. 4
    Reliability of Electronics in Harsh Environments

    Reliability of Electronics in Harsh Environments by Brox, B, Tegehall, P.-E

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