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    HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors

    HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors by Borzì, Aurelio, Zboray, Robert, Dolabella, Simone, Brun, Sébastien, Telmont, Florian, Kupferschmied, Peter, Néal, Jean-François Le, Drljaca, Pedrag, Fiorucci, Gianni, Dommann, Alex, Neels, Antonia

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