Search Results - Teo Keng Hwa

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  1. 1
    On the Impact of Through-Silicon-Via-Induced Stress on 65-nm CMOS Devices

    On the Impact of Through-Silicon-Via-Induced Stress on 65-nm CMOS Devices by Weerasekera, R., Hong Yu Li, Lim Wei Yi, Hu Sanming, Jinglin Shi, Je Minkyu, Keng Hwa Teo

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  2. 2
    A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs

    A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs by Sanming Hu, Hoe, Yen Yi Germaine, Hongyu Li, Dan Zhao, Jinglin Shi, Yong Han, Keng Hwa Teo, Yong Zhong Xiong, Jin He, Xiaowu Zhang, Minkyu Je, Madihian, M.

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  3. 3
    Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

    Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain by Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang

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  4. 4
    A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction

    A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction by Zhang, Li, Rafei, Siti Mohamed, Xie, Ling, Chew, Michelle Bi-Rong, Ji, Hong Miao, Chen, Yu, Rajoo, Ranjan, Ong, Kian-Leong, Tan, Rosemary, Lau, Suk-Hiang, Chow, Vincent T.K., Heng, Chew-Kiat, Teo, Keng-Hwa, Kang, Tae Goo

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  5. 5
    Compatibility of Dielectric Passivation and Temporary Bonding Materials for Thin Wafer Handling in 3-D TSV Integration

    Compatibility of Dielectric Passivation and Temporary Bonding Materials for Thin Wafer Handling in 3-D TSV Integration by Jaesik Lee, Seetoh, J., Hong Yu Li, Lee, V., Yen Chen Yeo, Guan Kian Lau, Keng Hwa Teo, Shan Gao

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  6. 6
    Study of high speed interconnects of multiple dies stack structure with Through-Silicon-Via (TSV)

    Study of high speed interconnects of multiple dies stack structure with Through-Silicon-Via (TSV) by Zhang Wenle, Khoo Yee Mong, Lim Teck Guan, Damaruganath, P, Teo Keng Hwa, Zhang Xiaowu

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  7. 7
    Low standoff Chip to Wafer bonding

    Low standoff Chip to Wafer bonding by Ser Choong Chong, Wee, David Ho Soon, Keng Hwa Teo

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  8. 8
    Investigation of 300 mm TSV wafer flatness with via middle scheme

    Investigation of 300 mm TSV wafer flatness with via middle scheme by Li Hongyu, Xie Jielin, Li Weihong, Teo Keng Hwa

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  9. 9
    Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack

    Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack by Lee, Hui Min, Liu, En-Xiao, Samudra, G.S., Li, Er-Ping, Li, Hong Yu, Teo, Keng Hwa

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  10. 10
    TSV via-last: Optimization of multilayer dielectric stack etching

    TSV via-last: Optimization of multilayer dielectric stack etching by Loh Woon Leng, Li Hongyu, Keng Hwa Teo, Murthy, R., Kiat, Eugene Tan Swee

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  11. 11
    Novel thinning/backside passivation for substrate coupling depression of 3D IC

    Novel thinning/backside passivation for substrate coupling depression of 3D IC by Woonseong Kwon, Jaesik Lee, Lee, V., Seetoh, J., Yenchen Yeo, YeeMong Khoo, Ranganathan, N., Keng Hwa Teo, Shan Gao

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  12. 12
    Design for reliability in via middle and via last 3-D chipstacks incorporating TSVs

    Design for reliability in via middle and via last 3-D chipstacks incorporating TSVs by Trigg, A.D., Hong Yu, Li, Zhong Xiong, Yong, Jing Lin, Shi, Cheng Kuo, Cheng, Khan, Navas, Keng Hwa, Teo, Shan, Gao

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  13. 13
    Advanced wafer thinning and handling for through silicon via technology

    Advanced wafer thinning and handling for through silicon via technology by Jaesik Lee, Lee, V., Seetoh, J., Thew, S. M. L., Yen Chen Yeo, Hong Yu Li, Keng Hwa Teo, Shan Gao

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  14. 14
    Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications

    Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications by Xie, Ling, Chew, Michelle, Premachandran, C.S., Zhang, Li, Rafei, Siti R.M., Ji, Hong Miao, Rajoo, Ranjan, Tang, Kum Cheong, Chen, Yu, Teo, Keng Hwa, Lau, Kelly Suk Hiang, Chow, Vincent T. K., Heng, Chew Kiat, Ong, Kian Leong, Tan, Rosemary

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  15. 15
    Mesenchymal Stem Cell Exosomes Promote Functional Osteochondral Repair in a Clinically Relevant Porcine Model

    Mesenchymal Stem Cell Exosomes Promote Functional Osteochondral Repair in a Clinically Relevant Porcine Model by Zhang, Shipin, Wong, Keng Lin, Ren, Xiafei, Teo, Kristeen Ye Wen, Afizah, Hassan, Choo, Andre Boon Hwa, Lai, Ruenn Chai, Lim, Sai Kiang, Hui, James Hoi Po, Toh, Wei Seong

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  16. 16
    Does soft TQM predict employees' attitudes?

    Does soft TQM predict employees' attitudes? by Keng Boon, Ooi, Arumugam, V, Seng Hwa, Teo

    Published in TQM magazine
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  17. 17
    Does soft TQM predict employees attitudes

    Does soft TQM predict employees attitudes by Keng Boon, Ooi, Arumugam, V., Seng Hwa, Teo

    Published in The TQM Magazine
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