Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste by Yamakawa, Tomohiro, Takemoto, Tadashi, Shimoda, Masayoshi, Nishikawa, Hiroshi, Shiokawa, Kunio, Terada, Nobuto

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Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging by Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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High-Speed Laser Plating for Wire-Bonding Pad Formation by Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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Evaluation of Inkjet Technology for Electronic Packaging and System Integration by Mantysalo, Matti, Mansikkamaki, Pauliina, Miettinen, Jani, Kaija, Kimmo, Pienimaa, Seppo, Ronkka, Risto, Hashizume, Kenichi, Kamigori, Akiko, Matsuba, Yorishige, Oyama, Kenshu, Terada, Nobuto, Saito, Hiroshi, Kuchiki, Mikiharu, Tsubouchi, Mikihiko

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High-speed laser plating on Cu leadframe using Ag nanoparticles by Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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Influence of wavelength on laser sintering characteristics of Ag nanoparticles by Maekawa, K., Yamasaki, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N., Saito, H.

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Temperature soak reliability of laser-sintered Ag pads for wire bonding by Yamasaki, K., Maekawa, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N., Saito, H.

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Laser sintering of Ag nanopaste film and its application to bond-pad formation by Niizeki, T., Maekawa, K., Mita, M., Yamasaki, K., Matsuba, Y., Terada, N., Saito, H.

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Size effect of Ag nanoparticles on laser sintering and wire bondability by Tsutsui, Yoshiyuki, Yamasaki, Kazuhiko, Maekawa, Katsuhiro, Niizeki, Tomotake, Bucheeri, Ahmed, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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Packaging of electronic modules through completely dry process by Maekawa, K., Mita, M., Yamasaki, K., Niizeki, T., Matsuba, Y., Terada, N., Saito, H.

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Electrical property of conductive adhesives using silver-coated copper filler by Nishikawa, H., Mikami, S., Terada, N., Miyake, K., Aoki, A., Takemoto, T.

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Mechanical compression of the carotid artery by the pharynx in the retropharyngeal space during swallowing and the induction of stenosis and embolic stroke: illustrative case by Suematsu, Takuya, Kawabata, Shuhei, Nishikawa, Yusuke, Hirai, Nobuto, Nakamura, Motoki, Terada, Eisaku, Kajikawa, Ryuichiro, Tsuzuki, Takashi

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Microvascular Response in the Periosteum Following Mucoperiosteal Flap Surgery in Dogs: Angiogenesis and Bone Resorption and Formation by Nobuto, Takahiro, Suwa, Fumihiko, Kono, Tomoo, Taguchi, Yoichiro, Takahashi, Tsurayuki, Kanemura, Naoko, Terada, Shoichiro, Imai, Hisao

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