Search Results - Teraki, Shin

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  1. 1
    Novel High Reliability and Low Dk/Df Dielectric RDL Material for High Frequency 5G Applications

    Novel High Reliability and Low Dk/Df Dielectric RDL Material for High Frequency 5G Applications by Hamada, Kaori, Sato, Toshiyuki, Teraki, Shin, Komatsu, Fumikazu, Yoshida, Masaki, Ikarashi, Hirotatsu, Patelka, Maciej, Ozaki, Hiroshi

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  2. 2
    High Performance Insulating Adhesive Film for High-Frequency Applications

    High Performance Insulating Adhesive Film for High-Frequency Applications by Sato, Junya, Teraki, Shin, Yoshida, Masaki, Kondo, Hisao

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  3. 3
    New insulating adhesive film for future high-frequency wearable devices

    New insulating adhesive film for future high-frequency wearable devices by Yoshida, Masaki, Teraki, Shin, Takahashi, Satoko

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  4. 4
    Development of the thin film with high thermal conductivity for power devices

    Development of the thin film with high thermal conductivity for power devices by Takasugi, Hiroshi, Teraki, Shin, Kurokawa, Tsuyoshi, Aoki, Issei

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  5. 5
    Effect of NCF design for the assembly of Flip Chip and reliability

    Effect of NCF design for the assembly of Flip Chip and reliability by Kawamoto, S., Yoshida, M., Teraki, S., Iida, H.

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