Search Results - Tesarski, S.J.

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    A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

    A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging by Weltevreden, E.R., Tesarski, S.J., Wymyslowski, A., Erinc, M., Gielen, A.W.J.

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  2. 2
    Susceptibility of solder masks on solderballing and webbing in wave soldering

    Susceptibility of solder masks on solderballing and webbing in wave soldering by Platek, B.T., Tesarski, S.J.

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    Conference Proceeding
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    An analysis of VOC-free fluxes and lead-free solders application in a manual SMD soldering

    An analysis of VOC-free fluxes and lead-free solders application in a manual SMD soldering by Tesarski, S.J., Urbanski, K.J., Platek, B.T.

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