Search Results - Teutsch, Thorsten

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  1. 1
    A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications

    A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications by Fettke, Matthias, Fisch, Anne, Geschke, Tom, Frick, Alexander, Alyasin, Khaled, Teutsch, Thorsten

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  2. 2
    Forming of advanced THT-interconnects using SB2 laser solder jetting process

    Forming of advanced THT-interconnects using SB2 laser solder jetting process by Fettke, Matthias, Bonow, Gero, Fisch, Anne, Nasser, Moshir, Friedrich, Georg, Baba, Rojhat, Teutsch, Thorsten

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  3. 3
    Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging

    Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging by Kolbasow, Andrej, Kubsch, Timo, Fettke, Matthias, Friedrich, Georg, Teutsch, Thorsten

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  4. 4
    Study of solder interconnect configurations and performance of vertical laser assisted assembled "3.5D" packages

    Study of solder interconnect configurations and performance of vertical laser assisted assembled "3.5D" packages by Kolbasow, Andrej, Fettke, Matthias, Kubsch, Timo, Bejugam, Vinith, Teutsch, Thorsten

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  5. 5
    Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

    Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages by Fettke, Matthias, Kubsch, Timo, Kolbasow, Andrej, Bejugam, Vinith, Frick, Alexander, Teutsch, Thorsten

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  6. 6
    A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

    A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding by Fettke, Matthias, Kubsch, Timo, Frick, Alexander, Bejugam, Vinith, Friedrich, Georg, Teutsch, Thorsten

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  7. 7
    Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons

    Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons by Strandjord, Andrew J., Scheffler, Axel, Zakel, Elke, Oppert, Thomas, Teutsch, Thorsten

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  8. 8
    Laser assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

    Laser assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures by Fettke, Matthias, Baba, Rojhat, Kubsch, Timo, Friedrich, Georg, Thalmann, Robert, Bejugam, Vinith, Yeoh, Kim Hoey, Teutsch, Thorsten

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  9. 9
    A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

    A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs by Fettke, Matthias, Kolbasow, Andrej, Bejugam, Vinith, Kubsch, Timo, Frick, Alexander, Teutsch, Thorsten, Wang, Yu-Chung, Rantala, Juha

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  10. 10
    Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices

    Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices by Fettke, Matthias, Kubsch, Timo, Fisch, Anne, Baa, Mohammed Ziad, Teutsch, Thorsten, Seifert, Tobias, Baum, Mario, Selbmann, Franz, Paul, Soumya Deep, Roscher, Frank, Kreyssig, Kerstin, Wiemer, Maik, Kuhn, Harald

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  11. 11
    SB²-WB: A New Process Solution for Advanced Wire-Bonding

    SB²-WB: A New Process Solution for Advanced Wire-Bonding by Fettke, Matthias, Kolbasow, Andrej, Friedrich, Georg, Palys, Anna, Bejugam, Vinith, Teutsch, Thorsten

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  12. 12
    Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

    Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting by Oppert, T., Teutsch, T., Azdasht, G., Zakel, E.

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  13. 13
    WLCSP and Flip Chip bumping technologies

    WLCSP and Flip Chip bumping technologies by Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Oppert, Thomas, Azdasht, Ghassem, Zakel, Elke

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  14. 14
    Lead-free Impact on Wafer Bumping & Wafer-level Packaging

    Lead-free Impact on Wafer Bumping & Wafer-level Packaging by Teutsch, Thorsten

    Published in Advanced packaging
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  15. 15
    Wafer Bumping & Wafer Level Packaging for 300mm Wafer

    Wafer Bumping & Wafer Level Packaging for 300mm Wafer by Oppert, T., Zakel, E., Teutsch, T.

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  16. 16
    Wafer level CSP using low cost electroless redistribution layer

    Wafer level CSP using low cost electroless redistribution layer by Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.

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  17. 17
    Lead-free solder bumping process for high temperature automotive application

    Lead-free solder bumping process for high temperature automotive application by Teutsch, T., Blankenhorn, R.G., Zakel, E.

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  18. 18
    Low cost flip chip bumping

    Low cost flip chip bumping by Oppert, T., Teutsch, T., Zakel, E.

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  19. 19
    The Electrochemical Effects of Immersion Au on Electroless Nickel and Its Consequences on the Hermetic Reliability of a Semiconductor Device

    The Electrochemical Effects of Immersion Au on Electroless Nickel and Its Consequences on the Hermetic Reliability of a Semiconductor Device by Herbsommer, J., Teutsch, T., Strandjord, A.

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  20. 20
    Pulsed-laser Heating for Flip Chip Assembly

    Pulsed-laser Heating for Flip Chip Assembly by Teutsch, Thorsten, Zakel, Elke, Azdasht, Ghassem

    Published in Advanced packaging
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