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Early transient creep of single crystal SnAgCu solder joints
by
Das, Ronit
,
Thekkut, Sanoop
,
Sivasubramony, Rajesh Sharma
,
Alghoul, Thaer
,
Mahmood, Atif
,
Joshi, Shantanu
,
Arroyo, Carlos
,
Sharma, Gaurav
,
Borgesen, Peter
Published in
Journal of materials science. Materials in electronics
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Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors
by
Sivasubramony, Rajesh Sharma
,
Adams, Nardeeka
,
Alhendi, Mohammed
,
Khinda, Gurvinder Singh
,
Kokash, Maan Z
,
Lombardi, Jack P
,
Raj, Arun
,
Thekkut, Sanoop
,
Weerawarne, Darshana L
,
Yadav, Manu
,
Zachariah, Ashwin Varkey
,
Stoffel, Nancy C
,
Shaddock, David M
,
Yin, Liang
,
Poliks, Mark D
,
Borgesen, Peter
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Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor
by
Alghoul, Thaer M.
,
Yadav, Manu
,
Thekkut, Sanoop
,
Sivasubramony, Rajesh S.
,
Greene, Christopher M.
,
Poliks, Mark D.
,
Borgesen, Peter
,
Wentlent, Luke
,
Meilunas, Michael
,
Stoffel, Nancy
,
Shaddock, David M.
,
Liang Yin
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Conference Proceeding
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Journal Of Materials Science. Materials In Electronics
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