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Numerical and experimental investigation on heat transfer of multi-heat sources mounted on an array of printed circuit boards in a rectangular case
by
Thepsut, Warakorn
,
Pratinthong, Naris
Published in
Applied thermal engineering
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Applied Thermal Engineering
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Aluminum
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Ambient Temperature
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Arrays
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Circuit Boards
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Computer Simulation
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Conjugate Heat Transfer
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Electronic Cooling
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Energy & Fuels
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Engineering
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Engineering, Mechanical
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Forced Convection
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Free Convection
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Heat Sources
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Heat Transfer
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Horizontal Orientation
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Printed Circuit Board Assembly
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