A Bulk Acoustic Wave (BAW) Based Transceiver for an In-Tire-Pressure Monitoring Sensor Node by Flatscher, M., Dielacher, M., Herndl, T., Lentsch, T., Matischek, R., Prainsack, J., Pribyl, W., Theuss, H., Weber, W.

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Packaging for MEMS and Sensors - Challenges and Opportunities by Theuss, Horst

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Characterization of partial discharge performance of die attach adhesives by Schaller, Rainer, Strutz, Volker, Theuss, Horst, Dudek, Rainer, Rzepka, Sven

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Novel approach for reliability testing of high voltage isolated semiconductor packages by Schaller, Rainer, Theuss, Horst

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Trends in Fan Out Wafer Level Packaging by Theuss, Horst, Geissler, Christian, Hartner, Walter

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Integration of polymer bonded magnets into magnetic sensors by Elian, Klaus, Theuss, Horst

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A robust wireless sensor node for in-tire-pressure monitoring by Flatscher, M., Dielacher, M., Herndl, T., Lentsch, T., Matischek, R., Prainsack, J., Pribyl, W., Theuss, H., Weber, W.

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A MEMS Microphone in a FOWLP by Theuss, Horst, Sigl, Alfred, Maier, Dominic, Goller, Bernd, Vobl, Matthias, Herrmann, Matthias, Lodermeyer, Johannes, Krumbein, Ulrich, Dehe, Alfons, Geissler, Christian, Muehlbauer, Franz-Xaver, von Waechter, Claus, Kilger, Thomas, Wagner, Juergen, Fischer, Thomas, Bartl, Ulf, Helbig, Stephan

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Solder joint reliability of lead-free solder balls assembled with snpb solder paste by Theuss, H., Kilger, T., Ort, T.

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Application of an Endothelial Cell Culture Assay for the Detection of Neutralizing Anti-Clostridium Perfringens Beta-Toxin Antibodies in a Porcine Vaccination Trial by Richard, Olivia K, Springer, Sven, Finzel, Jacqueline, Theuß, Tobias, Wyder, Marianne, Vidondo, Beatriz, Posthaus, Horst

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