Ocean warming undermines the recovery resilience of New England kelp forests following a fishery‐induced trophic cascade by Suskiewicz, Thew S., Byrnes, Jarrett E. K., Steneck, Robert S., Russell, Robert, Wilson, Carl J., Rasher, Douglas B.

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PHENOTYPIC PLASTICITY RECONCILES INCONGRUOUS MOLECULAR AND MORPHOLOGICAL TAXONOMIES: THE GIANT KELP, MACROCYSTIS (LAMINARIALES, PHAEOPHYCEAE), IS A MONOSPECIFIC GENUS1 by Demes, Kyle W., Graham, Michael H., Suskiewicz, Thew S.

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PHENOTYPIC PLASTICITY RECONCILES INCONGRUOUS MOLECULAR AND MORPHOLOGICAL TAXONOMIES: THE GIANT KELP, MACROCYSTIS (LAMINARIALES, PHAEOPHYCEAE), IS A MONOSPECIFIC GENUS by Demes, Kyle W, Graham, Michael H, Suskiewicz, Thew S

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Requirements Engineering for E-science: Experiences in Epidemiology by Thew, S., Sutcliffe, A., Procter, R., de Bruijn, O., McNaught, J., Venters, C.C., Buchan, I.

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Ocean warming undermines the recovery resilience of N ew E ngland kelp forests following a fishery‐induced trophic cascade by Suskiewicz, Thew S., Byrnes, Jarrett E. K., Steneck, Robert S., Russell, Robert, Wilson, Carl J., Rasher, Douglas B.

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Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization by Da-Quan Yu, Li Ling Yan, Chengkuo Lee, Won Kyoung Choi, Thew, S., Chin Keng Foo, Lau, J.H.

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PHENOTYPIC PLASTICITY RECONCILES INCONGRUOUS MOLECULAR AND MORPHOLOGICAL TAXONOMIES: THE GIANT KELP, MACROCYSTIS (LAMINARIALES, PHAEOPHYCEAE), IS A MONOSPECIFIC GENUS 1 by Demes, Kyle W., Graham, Michael H., Suskiewicz, Thew S.

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Analysing "people" problems in requirements engineering by Sutcliffe, Alistair, Thew, Sarah

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A Review and Framework for Categorizing Current Research and Development in Health Related Geographical Information Systems (GIS) Studies by Lyseen, A. K., Nøhr, C., Sørensen, E. M., Gudes, O., Geraghty, E. M., Shaw, N. T., Bivona-Tellez, C.

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Reliability of a Silicon Stacked Module for 3-D SiP Microsystem by Seung Wook Yoon, Lim, S.Y.L., Viswanath, A.G.K., Thew, S., Tai Chong Chai, Kripesh, V.

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Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking by Ling Xie, Won Kyoung Choi, Premachandran, C. S., Selvanayagam, C. S., Ke Wu Bai, Ying Zhi Zeng, Siong Chiew Ong, Ebin Liao, Khairyanto, A., Sekhar, V. N., Thew, S.

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The study of Shakespeare

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Investigating the Role of 'Soft Issues' in the RE Process by Thew, S., Sutcliffe, A.

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Risk profile analysis and complications after surgery for autoimmune thyroid disease by Thomusch, O., Sekulla, C., Billmann, F., Seifert, G., Dralle, H., Lorenz, K., Vorländer, C., Dralle, H., Freitag, M., Jähne, J., Steinmüller, T., Trupka, A., Steinert, F., Schabram, J., Heinzmann, B., Lang, H., Cotte, J., Hoffmann, T. F., Dette, K., Gellert, K., Henne‐Bruns, D., Boese‐Landgraf, J., Simon Evangelisches, D., Kube, R., Lorenz, E. P. M., Pross, M., Hartel, M., Thomschke, D., Pistorius, G., Hopt, U. T., Franke, C., Rose, U., Steuer, W., Schwenk, W., Ebert, K.‐H., Kelm, C., Witzigmann, H., Rampf, W., Ridwelski, K., Knoefel, W. T., Bechstein, W. O., Grothe, D., Anthuber, M., Mirow, L., Probst, W., Thews, A., Fleck, U., Kärgel, W., Schimmelpenning, H., Fielitz, J., Rose, U., Schöffauer, T., Asperger, W., Zaage, J., Dorn, H.‐U., Weitz, J., Neubauer, M., Klar, E., Lautermann, J., Senkal, M., Lippert, H., Lück, R., Ziesche, M., Kröll, K.‐P., Skrobisz, J., Lorenc, Z., Dudesek, B., Smutny, S., Brauckhoff, M., Längle, F., Wenzl, E.

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PHENOTYPIC PLASTICITY RECONCILES INCONGRUOUS MOLECULAR AND MORPHOLOGICAL TAXONOMIES: THE GIANT KELP, MACROCYSTIS (LAMINARIALES, PHAEOPHYCEAE), IS A MONOSPECIFIC GENUS by Demes, Kyle W., Graham, Michael H., Suskiewicz, Thew S.

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First use of intracoronary beta-radiation to prevent recurrent in-stent restenosis in a transplanted heart by Thew, Stephen T., Snell, R. Jeffery, Klein, Lloyd W.

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Advanced wafer thinning and handling for through silicon via technology by Jaesik Lee, Lee, V., Seetoh, J., Thew, S. M. L., Yen Chen Yeo, Hong Yu Li, Keng Hwa Teo, Shan Gao

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Judges' notebooks

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Embedding of 15um thin chip and passives in thin flexible substrate by Rajoo, Ranjan, Lim, Y Y, Chong, S C, Myo Paing, Moses, F D, Hong, Justin See Toh Wai, Sekhar, V N, Soon Wee Ho, Thew, S, Soon, Justin Wee Kim, Xiaowu Zhang

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Solder joint encapsulation and reliability using dippable underfill by Yen Chen Yeo, Huang, M, Fa Xing Che, Ser Choong Chong, Lim, K C S, Thew, S, Vasarla, N S, Shan Gao

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