Thermal characterization of vertical multichip modules MCM-V by Cahill, C., Compagno, A., O'Donovan, J., Slattery, O., O'Mathuna, S.C., Barrett, J., Serthelon, I., Val, C., Tigners, J.-P., Stern, J., Ivey, P., Masgrangeas, M., Coello-Vera, A.

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