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Search Results - Tofteberg, Hannah Rosquist
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Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
by
Malik, N.
,
Tofteberg, H. R.
,
Poppe, E.
,
Finstad, T. G.
,
Schjølberg-Henriksen, K.
Published in
ECS journal of solid state science and technology
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Technologies enabling 3D stacking of MEMS
by
Taklo, Maaike Margrete Visser
,
Mielnik, Michal Marek
,
Schjølberg-Henriksen, Kari
,
Storås, Preben
,
Tofteberg, Hannah Rosquist
,
Lietaer, Nicolas
,
Johannessen, Rolf
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Technologies enabling 3D stacking of MEMS
by
Taklo, Maaike Margrete Visser
,
Mielnik, Michal Marek
,
Schjølberg-Henriksen, Kari
,
Storås, Preben
,
Tofteberg, Hannah Rosquist
,
Lietaer, Nicolas
,
Johannessen, Rolf
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Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
by
Malik, Nishant
,
Tofteberg, Hannah Rosquist
,
Poppe, Erik
,
Finstad, Terje
,
Schjølberg-Henriksen, Kari
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Wafer-level Au–Au bonding in the 350–450 ◦C temperature range
by
Tofteberg, Hannah Rosquist
,
Schjølberg-Henriksen, Kari
,
Fasting, Eivind Johan
,
Moen, Alexander Stene
,
Taklo, Maaike Margrete Visser
,
Poppe, Erik
,
Simensen, Christian Julius
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Wafer-level Au–Au bonding in the 350–450 ◦C temperature range
by
Tofteberg, Hannah Rosquist
,
Schjølberg-Henriksen, Kari
,
Fasting, Eivind Johan
,
Moen, Alexander Stene
,
Taklo, Maaike Margrete Visser
,
Poppe, Erik
,
Simensen, Christian Julius
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TSV development for miniaturized MEMS acceleration switch
by
Lietaer, Nicolas
,
Summanwar, Anand
,
Dalsjø, Per G
,
Bakke, Thor
,
Tofteberg, Hannah Rosquist
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