Overlay as the key to drive wafer scale 3D integration by Steen, Steven E., LaTulipe, Douglas, Topol, Anna W., Frank, David J., Belote, Kevin, Posillico, Dominick

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Three-dimensional silicon integration by Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L

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Three-dimensional integrated circuits by Topol, A. W., Tulipe, D. C. La, Shi, L., Frank, D. J., Bernstein, K., Steen, S. E., Kumar, A., Singco, G. U., Young, A. M., Guarini, K. W., Ieong, M.

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Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes by Steen, Steven, McNab, Sharee J., Sekaric, Lidija, Babich, Inna, Patel, Jyotica, Bucchignano, Jim, Rooks, Michael, Fried, David M., Topol, Anna W., Brancaccio, Jim R., Yu, Roy, Hergenrother, John M., Doyle, James P., Nunes, Ron, Viswanathan, Raman G., Purushothaman, Sampath, Rothwell, Mary Beth

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Stable SRAM cell design for the 32 nm node and beyond by Chang, L., Fried, D.M., Hergenrother, J., Sleight, J.W., Dennard, R.H., Montoye, R.K., Sekaric, L., McNab, S.J., Topol, A.W., Adams, C.D., Guarini, K.W., Haensch, W.

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Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits by Kuan-Neng Chen, Sang Hwui Lee, Andry, P.S., Tsang, C.K., Topol, A.W., Yu-Ming Lin, Jian-Qiang Lu, Young, A.M., Meikei Ieong, Haensch, W.

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Extendibility of NiPt Silicide Contacts for CMOS Technology Demonstrated to the 22-nm Node by Ohuchi, K., Lavoie, C., Murray, C., D'Emic, C., Chu, J.O., Bin Yang, Besser, P., Gignac, L., Bruley, J., Singco, G.U., Pagette, F., Topol, A.W., Rooks, M.J., Bucchignano, J.J., Narayanan, V., Khare, M., Takayanagi, M., Ishimaru, K., Dae-Gyu Park, Shahidi, G., Solomon, P.

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Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures by TOPOL, Anna W, FURMAN, Bruce K, GUARINI, Kathryn W, SHI, Leathen, COHEN, Guy M, WALKER, George F

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Chemical Vapor Deposition of ZnS:Mn for Thin-Film Electroluminescent Display Applications by Topol, Anna W., Dunn, Kathleen A., Barth, Karl W., Nuesca, Guillermo M., Taylor, Brian K., Dovidenko, Katharine, Kaloyeros, Alain E., Tuenge, Richard T., King, Chris N.

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Blue- and green-emitting SrS:Cu electroluminescent devices deposited by the atomic layer deposition technique by Ihanus, Jarkko, Ritala, Mikko, Leskelä, Markku, Soininen, Erkki, Park, Wounjhang, Kaloyeros, Alain E., Harris, William, Barth, Karl W., Topol, Anna W., Sajavaara, Timo, Keinonen, Juhani

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Extendibility of NiPt silicide to the 22-nm node CMOS technology by Ohuchi, K., Lavoie, C., Murray, C.E., D'Emic, C.P., Lauer, I., Chu, J.O., Bin Yang, Besser, P., Gignac, L.M., Bruley, J., Singco, G.U., Pagette, F., Topol, A.W., Rooks, M.J., Bucchignano, J.J., Narayanan, V., Khare, M., Takayanagi, M., Ishimaru, K., Dae-Gyu Park, Shahidi, G., Solomon, P.M.

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Rimonabant for prevention of cardiovascular events (CRESCENDO): a randomised, multicentre, placebo-controlled trial by Topol, Eric J, Prof, Bousser, Marie-Germaine, Prof, Fox, Keith AA, Prof, Creager, Mark A, MD, Despres, Jean-Pierre, Prof, Easton, J Donald, Prof, Hamm, Christian W, Prof, Montalescot, Gilles, Prof, Steg, P Gabriel, Prof, Pearson, Thomas A, Prof, Cohen, Eric, MD, Gaudin, Christophe, MD, Job, Bernard, MD, Murphy, Judith H, MD, Bhatt, Deepak L, MD

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In situ pulsed deposition studies of Ce(tmhd)4 on SrS surfaces for thin film electroluminescent flat panel display applications by LAU, J. E, BARTH, K. W, PETERSON, G. G, ENDISCH, D, TOPOL, A, KALOYEROS, A. E, TUENGE, R. T, DELAROSA, M, KING, C. N

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Underwater surface recovery and segmentation by Jenkin, Michael, Hogue, Andrew, German, Andrew, Gill, Sunbir, Topol, Anna, Wilson, Stephanie

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